JPS55103970U - - Google Patents

Info

Publication number
JPS55103970U
JPS55103970U JP1979000841U JP84179U JPS55103970U JP S55103970 U JPS55103970 U JP S55103970U JP 1979000841 U JP1979000841 U JP 1979000841U JP 84179 U JP84179 U JP 84179U JP S55103970 U JPS55103970 U JP S55103970U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1979000841U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979000841U priority Critical patent/JPS55103970U/ja
Publication of JPS55103970U publication Critical patent/JPS55103970U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/536
    • H10W72/5363
    • H10W72/5449
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1979000841U 1979-01-11 1979-01-11 Pending JPS55103970U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979000841U JPS55103970U (cg-RX-API-DMAC10.html) 1979-01-11 1979-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979000841U JPS55103970U (cg-RX-API-DMAC10.html) 1979-01-11 1979-01-11

Publications (1)

Publication Number Publication Date
JPS55103970U true JPS55103970U (cg-RX-API-DMAC10.html) 1980-07-19

Family

ID=28802463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979000841U Pending JPS55103970U (cg-RX-API-DMAC10.html) 1979-01-11 1979-01-11

Country Status (1)

Country Link
JP (1) JPS55103970U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192509A (ja) * 2009-02-16 2010-09-02 Dainippon Printing Co Ltd 樹脂封止型半導体装置、リードフレーム、リードフレームの製造方法、および樹脂封止型半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192509A (ja) * 2009-02-16 2010-09-02 Dainippon Printing Co Ltd 樹脂封止型半導体装置、リードフレーム、リードフレームの製造方法、および樹脂封止型半導体装置の製造方法

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