JPS5510134B2 - - Google Patents

Info

Publication number
JPS5510134B2
JPS5510134B2 JP7972474A JP7972474A JPS5510134B2 JP S5510134 B2 JPS5510134 B2 JP S5510134B2 JP 7972474 A JP7972474 A JP 7972474A JP 7972474 A JP7972474 A JP 7972474A JP S5510134 B2 JPS5510134 B2 JP S5510134B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7972474A
Other languages
Japanese (ja)
Other versions
JPS5040075A (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5040075A publication Critical patent/JPS5040075A/ja
Publication of JPS5510134B2 publication Critical patent/JPS5510134B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
JP7972474A 1973-07-16 1974-07-11 Expired JPS5510134B2 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2336152A DE2336152C3 (de) 1973-07-16 1973-07-16 Halbleiterbauelement

Publications (2)

Publication Number Publication Date
JPS5040075A JPS5040075A (en:Method) 1975-04-12
JPS5510134B2 true JPS5510134B2 (en:Method) 1980-03-14

Family

ID=5887096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7972474A Expired JPS5510134B2 (en:Method) 1973-07-16 1974-07-11

Country Status (8)

Country Link
JP (1) JPS5510134B2 (en:Method)
BE (1) BE817065A (en:Method)
CA (1) CA1015070A (en:Method)
DE (1) DE2336152C3 (en:Method)
FR (1) FR2238248B1 (en:Method)
GB (1) GB1474575A (en:Method)
IT (1) IT1017057B (en:Method)
SE (1) SE395201B (en:Method)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584058Y2 (ja) * 1976-08-10 1983-01-24 株式会社ターダ ガス器具
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
JPS5490732U (en:Method) * 1977-12-12 1979-06-27
JPS6123050U (ja) * 1985-06-17 1986-02-10 株式会社 同和 バ−ナにおける始動消火連動装置

Also Published As

Publication number Publication date
GB1474575A (en) 1977-05-25
DE2336152C3 (de) 1979-03-22
FR2238248A1 (en:Method) 1975-02-14
JPS5040075A (en:Method) 1975-04-12
DE2336152A1 (de) 1975-01-30
SE395201B (sv) 1977-08-01
BE817065A (fr) 1974-10-16
DE2336152B2 (de) 1978-07-20
IT1017057B (it) 1977-07-20
FR2238248B1 (en:Method) 1978-03-24
SE7409300L (en:Method) 1975-02-21
CA1015070A (en) 1977-08-02

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