JPS5492723U - - Google Patents
Info
- Publication number
- JPS5492723U JPS5492723U JP16776277U JP16776277U JPS5492723U JP S5492723 U JPS5492723 U JP S5492723U JP 16776277 U JP16776277 U JP 16776277U JP 16776277 U JP16776277 U JP 16776277U JP S5492723 U JPS5492723 U JP S5492723U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16776277U JPS5492723U (en) | 1977-12-14 | 1977-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16776277U JPS5492723U (en) | 1977-12-14 | 1977-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5492723U true JPS5492723U (en) | 1979-06-30 |
Family
ID=29168264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16776277U Pending JPS5492723U (en) | 1977-12-14 | 1977-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5492723U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11848249B2 (en) | 2019-09-26 | 2023-12-19 | Fujifilm Corporation | Manufacturing method for thermal conductive layer, manufacturing method for laminate, and manufacturing method for semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4729515U (en) * | 1971-04-30 | 1972-12-04 |
-
1977
- 1977-12-14 JP JP16776277U patent/JPS5492723U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4729515U (en) * | 1971-04-30 | 1972-12-04 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11848249B2 (en) | 2019-09-26 | 2023-12-19 | Fujifilm Corporation | Manufacturing method for thermal conductive layer, manufacturing method for laminate, and manufacturing method for semiconductor device |