JPS5491807A - Underwater pump installation device - Google Patents

Underwater pump installation device

Info

Publication number
JPS5491807A
JPS5491807A JP15975077A JP15975077A JPS5491807A JP S5491807 A JPS5491807 A JP S5491807A JP 15975077 A JP15975077 A JP 15975077A JP 15975077 A JP15975077 A JP 15975077A JP S5491807 A JPS5491807 A JP S5491807A
Authority
JP
Japan
Prior art keywords
coupling
pump
coupling surface
point
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15975077A
Other languages
Japanese (ja)
Inventor
Yutaka Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinmaywa Industries Ltd
Original Assignee
Shin Meiva Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Meiva Industry Ltd filed Critical Shin Meiva Industry Ltd
Priority to JP15975077A priority Critical patent/JPS5491807A/en
Publication of JPS5491807A publication Critical patent/JPS5491807A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

PURPOSE: To improve the water-tightness of connecting parts, by placing pump suspension parts nearly at the center of the flange coupling the thereby maintaining the flange coupling surface at a uniform pressure.
CONSTITUTION: In the installation position of pump 1, coupling point E of suspension member 4 and slant member 9 is chosen nearly on the line which devides the coupling surface of flanges 2 and 8 into equal upper and lower halves. The coupling surface is brought into pressure contact by the wedge action produced on the flange coupling surface and coupling point E by the weight of pump 1. Due to the weight of the pump, the force of pressure contact is slightly larger in the lower part of the flanges than the upper part. But, since coupling point E is on the line diving the coupling surface into two equal parts, there is no action to turn pump 1 upward or downward with coupling point as fulcrum, and the moment produced about point E as fulcrum eliminates the unequal contact pressure with the result that perfect water tightness is secured for the pressure coupling surface of flanges 2 and 8.
COPYRIGHT: (C)1979,JPO&Japio
JP15975077A 1977-12-29 1977-12-29 Underwater pump installation device Pending JPS5491807A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15975077A JPS5491807A (en) 1977-12-29 1977-12-29 Underwater pump installation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15975077A JPS5491807A (en) 1977-12-29 1977-12-29 Underwater pump installation device

Publications (1)

Publication Number Publication Date
JPS5491807A true JPS5491807A (en) 1979-07-20

Family

ID=15700434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15975077A Pending JPS5491807A (en) 1977-12-29 1977-12-29 Underwater pump installation device

Country Status (1)

Country Link
JP (1) JPS5491807A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008025514A (en) * 2006-07-24 2008-02-07 Shin Meiwa Ind Co Ltd Submerged pump device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322302B2 (en) * 1975-04-26 1978-07-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322302B2 (en) * 1975-04-26 1978-07-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008025514A (en) * 2006-07-24 2008-02-07 Shin Meiwa Ind Co Ltd Submerged pump device

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