JPS5482167A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5482167A
JPS5482167A JP15012877A JP15012877A JPS5482167A JP S5482167 A JPS5482167 A JP S5482167A JP 15012877 A JP15012877 A JP 15012877A JP 15012877 A JP15012877 A JP 15012877A JP S5482167 A JPS5482167 A JP S5482167A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15012877A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5754935B2 (https=
Inventor
Mitsuo Arai
Masajirou Takasaki
Tomoaki Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP15012877A priority Critical patent/JPS5482167A/ja
Publication of JPS5482167A publication Critical patent/JPS5482167A/ja
Publication of JPS5754935B2 publication Critical patent/JPS5754935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning

Landscapes

  • Wire Bonding (AREA)
JP15012877A 1977-12-14 1977-12-14 Wire bonding device Granted JPS5482167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15012877A JPS5482167A (en) 1977-12-14 1977-12-14 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15012877A JPS5482167A (en) 1977-12-14 1977-12-14 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS5482167A true JPS5482167A (en) 1979-06-30
JPS5754935B2 JPS5754935B2 (https=) 1982-11-20

Family

ID=15490085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15012877A Granted JPS5482167A (en) 1977-12-14 1977-12-14 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5482167A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327540A (en) * 1980-11-28 1982-05-04 International Harvester Company Header height control for a cotton harvester

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59163855U (ja) * 1983-04-19 1984-11-02 三菱電機株式会社 空気調和機のル−バ
JPS62176654U (https=) * 1986-04-28 1987-11-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327540A (en) * 1980-11-28 1982-05-04 International Harvester Company Header height control for a cotton harvester

Also Published As

Publication number Publication date
JPS5754935B2 (https=) 1982-11-20

Similar Documents

Publication Publication Date Title
JPS5574152A (en) Wire bonding device
JPS5482881A (en) Decoratively wire connecting device
JPS5456880A (en) Vibrating wire device
GB2051411B (en) Wire bonding apparatus
AU4109178A (en) Wire connecting apparatus
GB1556172A (en) Wire bonding unit
GB2008167B (en) Wire stay device
JPS5420393A (en) Electric connecting device
JPS5451476A (en) Device for bonding wires
JPS54121672A (en) Wire bonding device
JPS5414162A (en) Die bonding device
JPS5466770A (en) Device for bonding wires
JPS5482167A (en) Wire bonding device
JPS51146350A (en) Ultrasonic wire bonding device
JPS5466769A (en) Device for bonding wires
JPS5297167A (en) Connecting wire
JPS5425667A (en) Device for bonding wires
JPS5458356A (en) Pellet bonding device
JPS5423377A (en) Device for bonding wires
JPS5359291A (en) Device for bonding denture
AU4166078A (en) Wire tension
JPS5458357A (en) Pellet bonding device
JPS5290391A (en) Simplified bonding device
JPS53112484A (en) Device for connecting electric wire
JPS5416981A (en) Device for bonding wires