JPS5481353A - Surface treating agent of inorganic filler for thermosetting resin - Google Patents
Surface treating agent of inorganic filler for thermosetting resinInfo
- Publication number
- JPS5481353A JPS5481353A JP14953877A JP14953877A JPS5481353A JP S5481353 A JPS5481353 A JP S5481353A JP 14953877 A JP14953877 A JP 14953877A JP 14953877 A JP14953877 A JP 14953877A JP S5481353 A JPS5481353 A JP S5481353A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- inorganic filler
- treating agent
- surface treating
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14953877A JPS5481353A (en) | 1977-12-13 | 1977-12-13 | Surface treating agent of inorganic filler for thermosetting resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14953877A JPS5481353A (en) | 1977-12-13 | 1977-12-13 | Surface treating agent of inorganic filler for thermosetting resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5481353A true JPS5481353A (en) | 1979-06-28 |
Family
ID=15477322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14953877A Pending JPS5481353A (en) | 1977-12-13 | 1977-12-13 | Surface treating agent of inorganic filler for thermosetting resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5481353A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5920037A (en) * | 1997-05-12 | 1999-07-06 | International Business Machines Corporation | Conductive bonding design for metal backed circuits |
US6534724B1 (en) | 1997-05-28 | 2003-03-18 | International Business Machines Corporation | Enhanced design and process for a conductive adhesive |
US6613184B1 (en) | 1997-05-12 | 2003-09-02 | International Business Machines Corporation | Stable interfaces between electrically conductive adhesives and metals |
JP2015151381A (en) * | 2014-02-18 | 2015-08-24 | 日東化成株式会社 | Novel titanium compound, catalyst for urethane resin production containing the titanium compound, urethane resin composition manufactured in presence of the catalyst and manufacturing method of the urethane resin composition |
-
1977
- 1977-12-13 JP JP14953877A patent/JPS5481353A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5920037A (en) * | 1997-05-12 | 1999-07-06 | International Business Machines Corporation | Conductive bonding design for metal backed circuits |
US6178630B1 (en) | 1997-05-12 | 2001-01-30 | International Business Machines Corporation | Conductive bonding design and method for aluminum backed circuits |
US6613184B1 (en) | 1997-05-12 | 2003-09-02 | International Business Machines Corporation | Stable interfaces between electrically conductive adhesives and metals |
US6534724B1 (en) | 1997-05-28 | 2003-03-18 | International Business Machines Corporation | Enhanced design and process for a conductive adhesive |
US7063756B2 (en) | 1997-05-28 | 2006-06-20 | International Business Machines Corporation | Enhanced design and process for a conductive adhesive |
JP2015151381A (en) * | 2014-02-18 | 2015-08-24 | 日東化成株式会社 | Novel titanium compound, catalyst for urethane resin production containing the titanium compound, urethane resin composition manufactured in presence of the catalyst and manufacturing method of the urethane resin composition |
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