JPS5480070A - Cleaving device for single-crystal plate - Google Patents

Cleaving device for single-crystal plate

Info

Publication number
JPS5480070A
JPS5480070A JP14756277A JP14756277A JPS5480070A JP S5480070 A JPS5480070 A JP S5480070A JP 14756277 A JP14756277 A JP 14756277A JP 14756277 A JP14756277 A JP 14756277A JP S5480070 A JPS5480070 A JP S5480070A
Authority
JP
Japan
Prior art keywords
plate
cleaving
crystal plate
along
marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14756277A
Other languages
Japanese (ja)
Inventor
Seiji Iida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14756277A priority Critical patent/JPS5480070A/en
Publication of JPS5480070A publication Critical patent/JPS5480070A/en
Pending legal-status Critical Current

Links

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  • Dicing (AREA)

Abstract

PURPOSE: To ensure a high-yield cleaving with addition of the twisting strss positioning the single-crystal plate along the cleaving direction and with an inclination and applying the vertical external stress.
CONSTITUTION: Marking-off groove 6 is provided previously at the edge part of crystal plate 5, and holding plate 3 and 4 are distributed along the desired cleaving line with theirr tips opposed to each other. An inclination is given to the lower plate 31 and 41 of the holding plates against the surface of plate spring 2 ad along the cleaving direction of plate 5. When the mobile edge side of the plate spring is pressed down, plate 4 lowers down to apply the desired stress to the crystal plate. As a result, the cleaving is stared with the marking-off groove set as the starting point.
COPYRIGHT: (C)1979,JPO&Japio
JP14756277A 1977-12-08 1977-12-08 Cleaving device for single-crystal plate Pending JPS5480070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14756277A JPS5480070A (en) 1977-12-08 1977-12-08 Cleaving device for single-crystal plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14756277A JPS5480070A (en) 1977-12-08 1977-12-08 Cleaving device for single-crystal plate

Publications (1)

Publication Number Publication Date
JPS5480070A true JPS5480070A (en) 1979-06-26

Family

ID=15433139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14756277A Pending JPS5480070A (en) 1977-12-08 1977-12-08 Cleaving device for single-crystal plate

Country Status (1)

Country Link
JP (1) JPS5480070A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771628A3 (en) * 1995-10-30 1998-04-22 AT&T Corp. A fixture and method for laser fabrication by in-situ cleaving of semiconductor bars

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771628A3 (en) * 1995-10-30 1998-04-22 AT&T Corp. A fixture and method for laser fabrication by in-situ cleaving of semiconductor bars

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