JPS5471964U - - Google Patents

Info

Publication number
JPS5471964U
JPS5471964U JP1977145381U JP14538177U JPS5471964U JP S5471964 U JPS5471964 U JP S5471964U JP 1977145381 U JP1977145381 U JP 1977145381U JP 14538177 U JP14538177 U JP 14538177U JP S5471964 U JPS5471964 U JP S5471964U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977145381U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977145381U priority Critical patent/JPS5471964U/ja
Publication of JPS5471964U publication Critical patent/JPS5471964U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125Reinforcing structures
    • H01L2224/10126Bump collar

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1977145381U 1977-10-28 1977-10-28 Pending JPS5471964U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977145381U JPS5471964U (en) 1977-10-28 1977-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977145381U JPS5471964U (en) 1977-10-28 1977-10-28

Publications (1)

Publication Number Publication Date
JPS5471964U true JPS5471964U (en) 1979-05-22

Family

ID=29124877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977145381U Pending JPS5471964U (en) 1977-10-28 1977-10-28

Country Status (1)

Country Link
JP (1) JPS5471964U (en)

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