JPS5471123A - Water-solubilized coating composition - Google Patents

Water-solubilized coating composition

Info

Publication number
JPS5471123A
JPS5471123A JP13786177A JP13786177A JPS5471123A JP S5471123 A JPS5471123 A JP S5471123A JP 13786177 A JP13786177 A JP 13786177A JP 13786177 A JP13786177 A JP 13786177A JP S5471123 A JPS5471123 A JP S5471123A
Authority
JP
Japan
Prior art keywords
mole
bonded
resin
group
solubilization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13786177A
Other languages
Japanese (ja)
Inventor
Yutaka Otsuki
Yoshihiko Araki
Kazuho Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Oil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Oil Corp filed Critical Nippon Oil Corp
Priority to JP13786177A priority Critical patent/JPS5471123A/en
Publication of JPS5471123A publication Critical patent/JPS5471123A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a coating composition capable of low-temperature cure, easy water-solubilization, and for use in anode-depositing type electrodeposition coating of good film characteristics, comprising two sorts of resins each consisting of an acid group-contg. high polymer component with unsaturated group, to which different kind of diamine is bonded.
CONSTITUTION: The objective composition comprising (1) 10W90 parts by wt. of a resin composed of (A) highly-polymerized main chain component [a] of a molecular weight of 500W10,000, of an iodine value of 100W500, with C=C bond, to which (B) a basic group [b] with a content of 0.02W0.4 mole in 100g of the resin (1), of formula I (R1 is H or CH3; R2 and R3 are each 1W20C organic residue; X is H, etc.) before solubilization, is bonded, and (2) 90W10 parts by wt. of another resin composed of (C) the same kind of a main chain component [c] as that of the [a] to which (D) are bonded both basic group [d] and acid group [e] with contents of 0.01W0.1 mole and 0.02W0.4 mole in 100g of the resin (2) and of formulae II and III (R4 is H or CH3; R5, R6 and R7 are each 1W20C organic residue; Y is H, etc.) before solubilization, respectively. Furthermore, this composition is in a state neutralized with acid, also being brought to a solubilized state.
COPYRIGHT: (C)1979,JPO&Japio
JP13786177A 1977-11-18 1977-11-18 Water-solubilized coating composition Pending JPS5471123A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13786177A JPS5471123A (en) 1977-11-18 1977-11-18 Water-solubilized coating composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13786177A JPS5471123A (en) 1977-11-18 1977-11-18 Water-solubilized coating composition

Publications (1)

Publication Number Publication Date
JPS5471123A true JPS5471123A (en) 1979-06-07

Family

ID=15208463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13786177A Pending JPS5471123A (en) 1977-11-18 1977-11-18 Water-solubilized coating composition

Country Status (1)

Country Link
JP (1) JPS5471123A (en)

Similar Documents

Publication Publication Date Title
CA2071652A1 (en) Thermoplastic polymer composition
JPS5695902A (en) Uv-curable resin composition
KR870010123A (en) Impact resistant polyamide molding material
DE3461988D1 (en) Parenteral formulation of nimodipin, process for its preparation and its therapeutical use
JPS52139199A (en) Novel epoxy resin compositions
JPS5471123A (en) Water-solubilized coating composition
JPS5247842A (en) Stabilized synthetic resin compositions
JPS57165465A (en) Cathode-deposition type electrodeposition coating composition
JPS5467000A (en) Transparent thermosetting resin composition
WO1987007900A1 (en) Epoxy resin composition and process for preparing the same
JPS54123158A (en) Polyolefin resin composition
JPS5665024A (en) Curable resin composition
JPS555932A (en) Cathode deposition-type electrodeposition coating composition
JPS5665023A (en) Curable resin composition
JPS5536261A (en) Production of impact-resistant polyamide
ATE104598T1 (en) ADHESIVE COMPOSITIONS AND LAMINATES CONTAINING SUCH COMPOSITIONS.
JPS54127927A (en) Primer composition
JPS5582138A (en) Polyolefin resin composition
JPS553431A (en) Curable resin and curable coating composition
JPS5249259A (en) Ethylene copolymer compositions
JPS52127952A (en) Rubber compositions for use in bonding to zinc
JPS6440552A (en) Thermosetting resin composition
JPS5466999A (en) Transparent thermosetting resin composition
JPS56131642A (en) Adherent polyolefin resin composition
JPS5712037A (en) Epoxy-modified butadiene resin composition