JPS5469530A - Forming of partial nickel plating layer - Google Patents

Forming of partial nickel plating layer

Info

Publication number
JPS5469530A
JPS5469530A JP13742977A JP13742977A JPS5469530A JP S5469530 A JPS5469530 A JP S5469530A JP 13742977 A JP13742977 A JP 13742977A JP 13742977 A JP13742977 A JP 13742977A JP S5469530 A JPS5469530 A JP S5469530A
Authority
JP
Japan
Prior art keywords
forming
plating layer
nickel plating
partial nickel
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13742977A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5727949B2 (enrdf_load_stackoverflow
Inventor
Jiyunichi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP13742977A priority Critical patent/JPS5469530A/ja
Publication of JPS5469530A publication Critical patent/JPS5469530A/ja
Publication of JPS5727949B2 publication Critical patent/JPS5727949B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Chemically Coating (AREA)
JP13742977A 1977-11-15 1977-11-15 Forming of partial nickel plating layer Granted JPS5469530A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13742977A JPS5469530A (en) 1977-11-15 1977-11-15 Forming of partial nickel plating layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13742977A JPS5469530A (en) 1977-11-15 1977-11-15 Forming of partial nickel plating layer

Publications (2)

Publication Number Publication Date
JPS5469530A true JPS5469530A (en) 1979-06-04
JPS5727949B2 JPS5727949B2 (enrdf_load_stackoverflow) 1982-06-14

Family

ID=15198413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13742977A Granted JPS5469530A (en) 1977-11-15 1977-11-15 Forming of partial nickel plating layer

Country Status (1)

Country Link
JP (1) JPS5469530A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108546A1 (ja) * 2011-02-09 2012-08-16 大日本印刷株式会社 金めっき層を有するステンレス基板とステンレス基板への部分金めっきパターンの形成方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6285670U (enrdf_load_stackoverflow) * 1985-11-15 1987-06-01

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108546A1 (ja) * 2011-02-09 2012-08-16 大日本印刷株式会社 金めっき層を有するステンレス基板とステンレス基板への部分金めっきパターンの形成方法
JP5196086B2 (ja) * 2011-02-09 2013-05-15 大日本印刷株式会社 金めっき層を有するステンレス基板とステンレス基板への部分金めっきパターンの形成方法
US8828213B2 (en) 2011-02-09 2014-09-09 Dai Nippon Printing Co., Ltd. Stainless substrate having a gold-plating layer, and process of forming a partial gold-plating pattern on a stainless substrate
US10017862B2 (en) 2011-02-09 2018-07-10 Dai Nippon Printing Co., Ltd. Stainless substrate having a gold-plating layer, and process of forming a partial gold-plating pattern on a stainless substrate

Also Published As

Publication number Publication date
JPS5727949B2 (enrdf_load_stackoverflow) 1982-06-14

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