JPS5465664U - - Google Patents
Info
- Publication number
- JPS5465664U JPS5465664U JP1977140412U JP14041277U JPS5465664U JP S5465664 U JPS5465664 U JP S5465664U JP 1977140412 U JP1977140412 U JP 1977140412U JP 14041277 U JP14041277 U JP 14041277U JP S5465664 U JPS5465664 U JP S5465664U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977140412U JPS5754278Y2 (https=) | 1977-10-18 | 1977-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977140412U JPS5754278Y2 (https=) | 1977-10-18 | 1977-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5465664U true JPS5465664U (https=) | 1979-05-10 |
| JPS5754278Y2 JPS5754278Y2 (https=) | 1982-11-24 |
Family
ID=29115323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977140412U Expired JPS5754278Y2 (https=) | 1977-10-18 | 1977-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5754278Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925235A (ja) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | リ−ドフレ−ム押え装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5285470A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Lead frame fixing jig for wire bonding |
| JPS5435859U (https=) * | 1977-08-16 | 1979-03-08 |
-
1977
- 1977-10-18 JP JP1977140412U patent/JPS5754278Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5285470A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Lead frame fixing jig for wire bonding |
| JPS5435859U (https=) * | 1977-08-16 | 1979-03-08 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925235A (ja) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | リ−ドフレ−ム押え装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5754278Y2 (https=) | 1982-11-24 |