JPS5465664U - - Google Patents

Info

Publication number
JPS5465664U
JPS5465664U JP14041277U JP14041277U JPS5465664U JP S5465664 U JPS5465664 U JP S5465664U JP 14041277 U JP14041277 U JP 14041277U JP 14041277 U JP14041277 U JP 14041277U JP S5465664 U JPS5465664 U JP S5465664U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14041277U
Other languages
Japanese (ja)
Other versions
JPS5754278Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977140412U priority Critical patent/JPS5754278Y2/ja
Publication of JPS5465664U publication Critical patent/JPS5465664U/ja
Application granted granted Critical
Publication of JPS5754278Y2 publication Critical patent/JPS5754278Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1977140412U 1977-10-18 1977-10-18 Expired JPS5754278Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977140412U JPS5754278Y2 (enrdf_load_stackoverflow) 1977-10-18 1977-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977140412U JPS5754278Y2 (enrdf_load_stackoverflow) 1977-10-18 1977-10-18

Publications (2)

Publication Number Publication Date
JPS5465664U true JPS5465664U (enrdf_load_stackoverflow) 1979-05-10
JPS5754278Y2 JPS5754278Y2 (enrdf_load_stackoverflow) 1982-11-24

Family

ID=29115323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977140412U Expired JPS5754278Y2 (enrdf_load_stackoverflow) 1977-10-18 1977-10-18

Country Status (1)

Country Link
JP (1) JPS5754278Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925235A (ja) * 1982-07-31 1984-02-09 Shinkawa Ltd リ−ドフレ−ム押え装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285470A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Lead frame fixing jig for wire bonding
JPS5435859U (enrdf_load_stackoverflow) * 1977-08-16 1979-03-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285470A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Lead frame fixing jig for wire bonding
JPS5435859U (enrdf_load_stackoverflow) * 1977-08-16 1979-03-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925235A (ja) * 1982-07-31 1984-02-09 Shinkawa Ltd リ−ドフレ−ム押え装置

Also Published As

Publication number Publication date
JPS5754278Y2 (enrdf_load_stackoverflow) 1982-11-24

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