JPS5464470U - - Google Patents

Info

Publication number
JPS5464470U
JPS5464470U JP1977138350U JP13835077U JPS5464470U JP S5464470 U JPS5464470 U JP S5464470U JP 1977138350 U JP1977138350 U JP 1977138350U JP 13835077 U JP13835077 U JP 13835077U JP S5464470 U JPS5464470 U JP S5464470U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977138350U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977138350U priority Critical patent/JPS5464470U/ja
Publication of JPS5464470U publication Critical patent/JPS5464470U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1977138350U 1977-10-14 1977-10-14 Pending JPS5464470U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977138350U JPS5464470U (zh) 1977-10-14 1977-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977138350U JPS5464470U (zh) 1977-10-14 1977-10-14

Publications (1)

Publication Number Publication Date
JPS5464470U true JPS5464470U (zh) 1979-05-08

Family

ID=29111449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977138350U Pending JPS5464470U (zh) 1977-10-14 1977-10-14

Country Status (1)

Country Link
JP (1) JPS5464470U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051621A (ja) * 2001-08-06 2003-02-21 Sony Corp 発光素子の実装方法及び画像表示装置の製造方法
JP2009505393A (ja) * 2005-08-08 2009-02-05 ソウル オプト デバイス カンパニー リミテッド 交流型発光素子
JP2018519665A (ja) * 2015-07-16 2018-07-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス装置およびオプトエレクトロニクス装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051621A (ja) * 2001-08-06 2003-02-21 Sony Corp 発光素子の実装方法及び画像表示装置の製造方法
JP2009505393A (ja) * 2005-08-08 2009-02-05 ソウル オプト デバイス カンパニー リミテッド 交流型発光素子
JP2018519665A (ja) * 2015-07-16 2018-07-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス装置およびオプトエレクトロニクス装置の製造方法
US10854783B2 (en) 2015-07-16 2020-12-01 Osram Oled Gmbh Optoelectronic arrangement and method for producing an optoelectronic arrangement
US11527678B2 (en) 2015-07-16 2022-12-13 Osram Oled Gmbh Optoelectronic arrangement and method for producing an optoelectronic arrangement

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