JPS546055A - Device for mold-release in resin molding - Google Patents
Device for mold-release in resin moldingInfo
- Publication number
- JPS546055A JPS546055A JP7111177A JP7111177A JPS546055A JP S546055 A JPS546055 A JP S546055A JP 7111177 A JP7111177 A JP 7111177A JP 7111177 A JP7111177 A JP 7111177A JP S546055 A JPS546055 A JP S546055A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin molding
- release
- resin
- forcused
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: A device for mold release in resin molding in which molded products of resin is released by the pressure of the pressurized gas sent through a hole opened to the cavity in the mold without application of forcused load.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7111177A JPS546055A (en) | 1977-06-17 | 1977-06-17 | Device for mold-release in resin molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7111177A JPS546055A (en) | 1977-06-17 | 1977-06-17 | Device for mold-release in resin molding |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22684583A Division JPS59140019A (en) | 1983-12-02 | 1983-12-02 | Mold release device for resin molding die |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS546055A true JPS546055A (en) | 1979-01-17 |
Family
ID=13451106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7111177A Pending JPS546055A (en) | 1977-06-17 | 1977-06-17 | Device for mold-release in resin molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS546055A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864151A (en) * | 1981-10-14 | 1983-04-16 | Bunzo Hirano | Painting apparatus |
JPS6393584A (en) * | 1986-10-08 | 1988-04-23 | 東陶機器株式会社 | Industrial robot |
WO2006101029A1 (en) * | 2005-03-18 | 2006-09-28 | Bridgestone Corporation | Mold and method for foam molding |
JP2011062878A (en) * | 2009-09-16 | 2011-03-31 | Fujifilm Corp | Mold for wafer level lens, method for manufacturing wafer level lens array, wafer level lens array, lens module, and imaging unit |
-
1977
- 1977-06-17 JP JP7111177A patent/JPS546055A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864151A (en) * | 1981-10-14 | 1983-04-16 | Bunzo Hirano | Painting apparatus |
JPS6393584A (en) * | 1986-10-08 | 1988-04-23 | 東陶機器株式会社 | Industrial robot |
JPH0553593B2 (en) * | 1986-10-08 | 1993-08-10 | Toto Ltd | |
WO2006101029A1 (en) * | 2005-03-18 | 2006-09-28 | Bridgestone Corporation | Mold and method for foam molding |
JP2006256242A (en) * | 2005-03-18 | 2006-09-28 | Bridgestone Corp | Die for expansion-molding, and expansion-molding method |
JP2011062878A (en) * | 2009-09-16 | 2011-03-31 | Fujifilm Corp | Mold for wafer level lens, method for manufacturing wafer level lens array, wafer level lens array, lens module, and imaging unit |
CN102023325A (en) * | 2009-09-16 | 2011-04-20 | 富士胶片株式会社 | Forming mould for wafer scale lens array, manufacturing method for wafer scale lens array, wafer scale lens array, lens mould and shooting unit |
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