JPS5456359A - Protecting member of semicomductor device - Google Patents

Protecting member of semicomductor device

Info

Publication number
JPS5456359A
JPS5456359A JP12325377A JP12325377A JPS5456359A JP S5456359 A JPS5456359 A JP S5456359A JP 12325377 A JP12325377 A JP 12325377A JP 12325377 A JP12325377 A JP 12325377A JP S5456359 A JPS5456359 A JP S5456359A
Authority
JP
Japan
Prior art keywords
sheet
substrate
conductive
leads
protecting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12325377A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12325377A priority Critical patent/JPS5456359A/en
Publication of JPS5456359A publication Critical patent/JPS5456359A/en
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)

Abstract

PURPOSE: To make a semiconductor device protecting member suitable for transporting and protecting by affixing together a fiber from conductive material and a backing substrate.
CONSTITUTION: Conductive and elastic mateial which comprises mixing fine powder of carbon, iron, copper, Al, etc. in synthetic rubber or resin or iton or the like is molded to fibrous forms and the fibers are interwined to make a sheet 11. The sheet 11 is affixed onto a substrate 13 such as cardboard paper or the like. When a device is pierced and is thus packaged to the sheet, its leads 14 intertwines with the conductive and elastic fibers of the sheet 11 and therefore the device 12 does not come off and may be shorted among the leads. The substrate 13 prevnets the deformation of the sheet 11 and facilitates packaging and transportaion
COPYRIGHT: (C)1979,JPO&Japio
JP12325377A 1977-10-13 1977-10-13 Protecting member of semicomductor device Pending JPS5456359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12325377A JPS5456359A (en) 1977-10-13 1977-10-13 Protecting member of semicomductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12325377A JPS5456359A (en) 1977-10-13 1977-10-13 Protecting member of semicomductor device

Publications (1)

Publication Number Publication Date
JPS5456359A true JPS5456359A (en) 1979-05-07

Family

ID=14855985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12325377A Pending JPS5456359A (en) 1977-10-13 1977-10-13 Protecting member of semicomductor device

Country Status (1)

Country Link
JP (1) JPS5456359A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103147U (en) * 1981-12-28 1983-07-13 日本スチレンペ−パ−株式会社 conductive laminate
JPS5998648U (en) * 1982-12-22 1984-07-04 日本電気ホームエレクトロニクス株式会社 MOS semiconductor storage box
JPS6047277U (en) * 1983-09-07 1985-04-03 株式会社　武田産業 Packaging materials for integrated circuit components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103147U (en) * 1981-12-28 1983-07-13 日本スチレンペ−パ−株式会社 conductive laminate
JPH021260Y2 (en) * 1981-12-28 1990-01-12
JPS5998648U (en) * 1982-12-22 1984-07-04 日本電気ホームエレクトロニクス株式会社 MOS semiconductor storage box
JPS6047277U (en) * 1983-09-07 1985-04-03 株式会社　武田産業 Packaging materials for integrated circuit components

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