JPS5455268U - - Google Patents

Info

Publication number
JPS5455268U
JPS5455268U JP12951677U JP12951677U JPS5455268U JP S5455268 U JPS5455268 U JP S5455268U JP 12951677 U JP12951677 U JP 12951677U JP 12951677 U JP12951677 U JP 12951677U JP S5455268 U JPS5455268 U JP S5455268U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12951677U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12951677U priority Critical patent/JPS5455268U/ja
Publication of JPS5455268U publication Critical patent/JPS5455268U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP12951677U 1977-09-27 1977-09-27 Pending JPS5455268U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12951677U JPS5455268U (enrdf_load_stackoverflow) 1977-09-27 1977-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12951677U JPS5455268U (enrdf_load_stackoverflow) 1977-09-27 1977-09-27

Publications (1)

Publication Number Publication Date
JPS5455268U true JPS5455268U (enrdf_load_stackoverflow) 1979-04-17

Family

ID=29094247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12951677U Pending JPS5455268U (enrdf_load_stackoverflow) 1977-09-27 1977-09-27

Country Status (1)

Country Link
JP (1) JPS5455268U (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55160452A (en) * 1979-06-01 1980-12-13 Nec Corp Hybrid integrated circuit
JPH027534A (ja) * 1988-06-27 1990-01-11 Fujitsu Ltd 半導体装置
JP2014187180A (ja) * 2013-03-22 2014-10-02 Mitsubishi Materials Corp 半導体装置用接合体、パワーモジュール用基板及びパワーモジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506144A (enrdf_load_stackoverflow) * 1973-05-18 1975-01-22
JPS5132358U (enrdf_load_stackoverflow) * 1974-08-30 1976-03-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506144A (enrdf_load_stackoverflow) * 1973-05-18 1975-01-22
JPS5132358U (enrdf_load_stackoverflow) * 1974-08-30 1976-03-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55160452A (en) * 1979-06-01 1980-12-13 Nec Corp Hybrid integrated circuit
JPH027534A (ja) * 1988-06-27 1990-01-11 Fujitsu Ltd 半導体装置
JP2014187180A (ja) * 2013-03-22 2014-10-02 Mitsubishi Materials Corp 半導体装置用接合体、パワーモジュール用基板及びパワーモジュール

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