JPS5450960U - - Google Patents

Info

Publication number
JPS5450960U
JPS5450960U JP1977124363U JP12436377U JPS5450960U JP S5450960 U JPS5450960 U JP S5450960U JP 1977124363 U JP1977124363 U JP 1977124363U JP 12436377 U JP12436377 U JP 12436377U JP S5450960 U JPS5450960 U JP S5450960U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977124363U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977124363U priority Critical patent/JPS5450960U/ja
Publication of JPS5450960U publication Critical patent/JPS5450960U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1977124363U 1977-09-14 1977-09-14 Pending JPS5450960U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977124363U JPS5450960U (enExample) 1977-09-14 1977-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977124363U JPS5450960U (enExample) 1977-09-14 1977-09-14

Publications (1)

Publication Number Publication Date
JPS5450960U true JPS5450960U (enExample) 1979-04-09

Family

ID=29084308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977124363U Pending JPS5450960U (enExample) 1977-09-14 1977-09-14

Country Status (1)

Country Link
JP (1) JPS5450960U (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128461A (enExample) * 1974-09-03 1976-03-10 Nippon Electric Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128461A (enExample) * 1974-09-03 1976-03-10 Nippon Electric Co

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