JPS544838B2 - - Google Patents
Info
- Publication number
- JPS544838B2 JPS544838B2 JP6997175A JP6997175A JPS544838B2 JP S544838 B2 JPS544838 B2 JP S544838B2 JP 6997175 A JP6997175 A JP 6997175A JP 6997175 A JP6997175 A JP 6997175A JP S544838 B2 JPS544838 B2 JP S544838B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/0915—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light
- H01S3/092—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light of flash lamp
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50069971A JPS51145294A (en) | 1975-06-10 | 1975-06-10 | Laser apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50069971A JPS51145294A (en) | 1975-06-10 | 1975-06-10 | Laser apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51145294A JPS51145294A (en) | 1976-12-14 |
| JPS544838B2 true JPS544838B2 (enExample) | 1979-03-10 |
Family
ID=13418039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50069971A Granted JPS51145294A (en) | 1975-06-10 | 1975-06-10 | Laser apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51145294A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LU86694A1 (fr) * | 1986-12-01 | 1988-07-14 | Centre Rech Metallurgique | Procede de marquage de la surface d'un cylindre a l'aide d'un faisceau laser |
-
1975
- 1975-06-10 JP JP50069971A patent/JPS51145294A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51145294A (en) | 1976-12-14 |