JPS5448159A - Wire bonding unit with container - Google Patents

Wire bonding unit with container

Info

Publication number
JPS5448159A
JPS5448159A JP11442377A JP11442377A JPS5448159A JP S5448159 A JPS5448159 A JP S5448159A JP 11442377 A JP11442377 A JP 11442377A JP 11442377 A JP11442377 A JP 11442377A JP S5448159 A JPS5448159 A JP S5448159A
Authority
JP
Japan
Prior art keywords
container
wire bonding
bonding unit
unit
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11442377A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5760210B2 (enrdf_load_stackoverflow
Inventor
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP11442377A priority Critical patent/JPS5448159A/ja
Publication of JPS5448159A publication Critical patent/JPS5448159A/ja
Publication of JPS5760210B2 publication Critical patent/JPS5760210B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container Filling Or Packaging Operations (AREA)
  • Wire Bonding (AREA)
JP11442377A 1977-09-23 1977-09-23 Wire bonding unit with container Granted JPS5448159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11442377A JPS5448159A (en) 1977-09-23 1977-09-23 Wire bonding unit with container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11442377A JPS5448159A (en) 1977-09-23 1977-09-23 Wire bonding unit with container

Publications (2)

Publication Number Publication Date
JPS5448159A true JPS5448159A (en) 1979-04-16
JPS5760210B2 JPS5760210B2 (enrdf_load_stackoverflow) 1982-12-18

Family

ID=14637333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11442377A Granted JPS5448159A (en) 1977-09-23 1977-09-23 Wire bonding unit with container

Country Status (1)

Country Link
JP (1) JPS5448159A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170092A (ja) * 1974-12-13 1976-06-17 Sanyo Electric Co Teeburuidosochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170092A (ja) * 1974-12-13 1976-06-17 Sanyo Electric Co Teeburuidosochi

Also Published As

Publication number Publication date
JPS5760210B2 (enrdf_load_stackoverflow) 1982-12-18

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