JPS5444634B2 - - Google Patents

Info

Publication number
JPS5444634B2
JPS5444634B2 JP16067376A JP16067376A JPS5444634B2 JP S5444634 B2 JPS5444634 B2 JP S5444634B2 JP 16067376 A JP16067376 A JP 16067376A JP 16067376 A JP16067376 A JP 16067376A JP S5444634 B2 JPS5444634 B2 JP S5444634B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16067376A
Other languages
Japanese (ja)
Other versions
JPS5384680A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16067376A priority Critical patent/JPS5384680A/ja
Publication of JPS5384680A publication Critical patent/JPS5384680A/ja
Publication of JPS5444634B2 publication Critical patent/JPS5444634B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP16067376A 1976-12-29 1976-12-29 Method of producing semiconductor Granted JPS5384680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16067376A JPS5384680A (en) 1976-12-29 1976-12-29 Method of producing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16067376A JPS5384680A (en) 1976-12-29 1976-12-29 Method of producing semiconductor

Publications (2)

Publication Number Publication Date
JPS5384680A JPS5384680A (en) 1978-07-26
JPS5444634B2 true JPS5444634B2 (en:Method) 1979-12-27

Family

ID=15719996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16067376A Granted JPS5384680A (en) 1976-12-29 1976-12-29 Method of producing semiconductor

Country Status (1)

Country Link
JP (1) JPS5384680A (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123080A (en) * 1977-04-02 1978-10-27 Ngk Insulators Ltd Circuit substrate and ceramic package assembly and method of producing same
JPS5555072A (en) * 1978-10-18 1980-04-22 Honda Motor Co Ltd Preparation of fuel tank

Also Published As

Publication number Publication date
JPS5384680A (en) 1978-07-26

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