JPS5442971U - - Google Patents
Info
- Publication number
- JPS5442971U JPS5442971U JP11502577U JP11502577U JPS5442971U JP S5442971 U JPS5442971 U JP S5442971U JP 11502577 U JP11502577 U JP 11502577U JP 11502577 U JP11502577 U JP 11502577U JP S5442971 U JPS5442971 U JP S5442971U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977115025U JPS5810369Y2 (ja) | 1977-08-26 | 1977-08-26 | 多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977115025U JPS5810369Y2 (ja) | 1977-08-26 | 1977-08-26 | 多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5442971U true JPS5442971U (enExample) | 1979-03-23 |
| JPS5810369Y2 JPS5810369Y2 (ja) | 1983-02-25 |
Family
ID=29066296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977115025U Expired JPS5810369Y2 (ja) | 1977-08-26 | 1977-08-26 | 多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810369Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5715106U (enExample) * | 1980-02-28 | 1982-01-26 |
-
1977
- 1977-08-26 JP JP1977115025U patent/JPS5810369Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5715106U (enExample) * | 1980-02-28 | 1982-01-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5810369Y2 (ja) | 1983-02-25 |