JPS5442617Y2 - - Google Patents

Info

Publication number
JPS5442617Y2
JPS5442617Y2 JP1975025650U JP2565075U JPS5442617Y2 JP S5442617 Y2 JPS5442617 Y2 JP S5442617Y2 JP 1975025650 U JP1975025650 U JP 1975025650U JP 2565075 U JP2565075 U JP 2565075U JP S5442617 Y2 JPS5442617 Y2 JP S5442617Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975025650U
Other languages
Japanese (ja)
Other versions
JPS51107259U (xx
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975025650U priority Critical patent/JPS5442617Y2/ja
Publication of JPS51107259U publication Critical patent/JPS51107259U/ja
Application granted granted Critical
Publication of JPS5442617Y2 publication Critical patent/JPS5442617Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1975025650U 1975-02-24 1975-02-24 Expired JPS5442617Y2 (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975025650U JPS5442617Y2 (xx) 1975-02-24 1975-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975025650U JPS5442617Y2 (xx) 1975-02-24 1975-02-24

Publications (2)

Publication Number Publication Date
JPS51107259U JPS51107259U (xx) 1976-08-27
JPS5442617Y2 true JPS5442617Y2 (xx) 1979-12-11

Family

ID=28124537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975025650U Expired JPS5442617Y2 (xx) 1975-02-24 1975-02-24

Country Status (1)

Country Link
JP (1) JPS5442617Y2 (xx)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946872A (xx) * 1972-09-08 1974-05-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946872A (xx) * 1972-09-08 1974-05-07

Also Published As

Publication number Publication date
JPS51107259U (xx) 1976-08-27

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