JPS5442473U - - Google Patents
Info
- Publication number
- JPS5442473U JPS5442473U JP11574777U JP11574777U JPS5442473U JP S5442473 U JPS5442473 U JP S5442473U JP 11574777 U JP11574777 U JP 11574777U JP 11574777 U JP11574777 U JP 11574777U JP S5442473 U JPS5442473 U JP S5442473U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11574777U JPS5442473U (enExample) | 1977-08-31 | 1977-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11574777U JPS5442473U (enExample) | 1977-08-31 | 1977-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5442473U true JPS5442473U (enExample) | 1979-03-22 |
Family
ID=29067663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11574777U Pending JPS5442473U (enExample) | 1977-08-31 | 1977-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5442473U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427985U (enExample) * | 1987-08-12 | 1989-02-17 | ||
| JPH0298927A (ja) * | 1988-10-06 | 1990-04-11 | Shin Etsu Handotai Co Ltd | 研磨装置 |
| WO2000025980A1 (en) * | 1998-10-30 | 2000-05-11 | Shin-Etsu Handotai Co., Ltd. | Method and apparatus for grinding wafer |
-
1977
- 1977-08-31 JP JP11574777U patent/JPS5442473U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427985U (enExample) * | 1987-08-12 | 1989-02-17 | ||
| JPH0298927A (ja) * | 1988-10-06 | 1990-04-11 | Shin Etsu Handotai Co Ltd | 研磨装置 |
| WO2000025980A1 (en) * | 1998-10-30 | 2000-05-11 | Shin-Etsu Handotai Co., Ltd. | Method and apparatus for grinding wafer |