JPS5441671A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5441671A JPS5441671A JP10864177A JP10864177A JPS5441671A JP S5441671 A JPS5441671 A JP S5441671A JP 10864177 A JP10864177 A JP 10864177A JP 10864177 A JP10864177 A JP 10864177A JP S5441671 A JPS5441671 A JP S5441671A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mold thickness
- make thin
- semiconductor chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10864177A JPS5441671A (en) | 1977-09-08 | 1977-09-08 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10864177A JPS5441671A (en) | 1977-09-08 | 1977-09-08 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5441671A true JPS5441671A (en) | 1979-04-03 |
JPS5716738B2 JPS5716738B2 (enrdf_load_stackoverflow) | 1982-04-07 |
Family
ID=14489936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10864177A Granted JPS5441671A (en) | 1977-09-08 | 1977-09-08 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5441671A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5471986A (en) * | 1977-11-18 | 1979-06-08 | Toshiba Corp | Semiconductor device and production thereof |
JPS5669850A (en) * | 1979-11-09 | 1981-06-11 | Citizen Watch Co Ltd | Method for sealing semiconductor device |
JPS5989423A (ja) * | 1982-11-15 | 1984-05-23 | Hitachi Ltd | 薄型樹脂封止半導体の製造方法 |
JPS59168655A (ja) * | 1983-03-16 | 1984-09-22 | Hitachi Ltd | 半導体の封止方法および半導体封止パツケ−ジ |
JPS59184549A (ja) * | 1983-04-04 | 1984-10-19 | Hitachi Ltd | 樹脂封止半導体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5116877A (enrdf_load_stackoverflow) * | 1974-07-31 | 1976-02-10 | Sharp Kk |
-
1977
- 1977-09-08 JP JP10864177A patent/JPS5441671A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5116877A (enrdf_load_stackoverflow) * | 1974-07-31 | 1976-02-10 | Sharp Kk |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5471986A (en) * | 1977-11-18 | 1979-06-08 | Toshiba Corp | Semiconductor device and production thereof |
JPS5669850A (en) * | 1979-11-09 | 1981-06-11 | Citizen Watch Co Ltd | Method for sealing semiconductor device |
JPS5989423A (ja) * | 1982-11-15 | 1984-05-23 | Hitachi Ltd | 薄型樹脂封止半導体の製造方法 |
JPS59168655A (ja) * | 1983-03-16 | 1984-09-22 | Hitachi Ltd | 半導体の封止方法および半導体封止パツケ−ジ |
JPS59184549A (ja) * | 1983-04-04 | 1984-10-19 | Hitachi Ltd | 樹脂封止半導体 |
Also Published As
Publication number | Publication date |
---|---|
JPS5716738B2 (enrdf_load_stackoverflow) | 1982-04-07 |
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