JPS5438053B1 - - Google Patents
Info
- Publication number
- JPS5438053B1 JPS5438053B1 JP12523870A JP12523870A JPS5438053B1 JP S5438053 B1 JPS5438053 B1 JP S5438053B1 JP 12523870 A JP12523870 A JP 12523870A JP 12523870 A JP12523870 A JP 12523870A JP S5438053 B1 JPS5438053 B1 JP S5438053B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12523870A JPS5438053B1 (fr) | 1970-12-28 | 1970-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12523870A JPS5438053B1 (fr) | 1970-12-28 | 1970-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5438053B1 true JPS5438053B1 (fr) | 1979-11-19 |
Family
ID=14905202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12523870A Pending JPS5438053B1 (fr) | 1970-12-28 | 1970-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5438053B1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996025838A1 (fr) * | 1995-02-16 | 1996-08-22 | Mitsui Mining & Smelting Co., Ltd. | Feuille de cuivre pour circuit imprime multicouche a haute densite |
| CN113235139A (zh) * | 2021-05-10 | 2021-08-10 | 江西理工大学 | 铜箔及其制备方法和应用 |
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1970
- 1970-12-28 JP JP12523870A patent/JPS5438053B1/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996025838A1 (fr) * | 1995-02-16 | 1996-08-22 | Mitsui Mining & Smelting Co., Ltd. | Feuille de cuivre pour circuit imprime multicouche a haute densite |
| CN1076154C (zh) * | 1995-02-16 | 2001-12-12 | 三井金属矿业株式会社 | 铜箔及采用该铜箔制作内层电路的高密度多层印刷电路板 |
| CN113235139A (zh) * | 2021-05-10 | 2021-08-10 | 江西理工大学 | 铜箔及其制备方法和应用 |
| CN113235139B (zh) * | 2021-05-10 | 2022-06-17 | 江西理工大学 | 含稀土盐配液制备米粒状铜箔的方法及其应用 |