JPS5437473B2 - - Google Patents
Info
- Publication number
- JPS5437473B2 JPS5437473B2 JP6921771A JP6921771A JPS5437473B2 JP S5437473 B2 JPS5437473 B2 JP S5437473B2 JP 6921771 A JP6921771 A JP 6921771A JP 6921771 A JP6921771 A JP 6921771A JP S5437473 B2 JPS5437473 B2 JP S5437473B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/41—Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/41—Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6921771A JPS5437473B2 (enrdf_load_stackoverflow) | 1971-09-09 | 1971-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6921771A JPS5437473B2 (enrdf_load_stackoverflow) | 1971-09-09 | 1971-09-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4834674A JPS4834674A (enrdf_load_stackoverflow) | 1973-05-21 |
| JPS5437473B2 true JPS5437473B2 (enrdf_load_stackoverflow) | 1979-11-15 |
Family
ID=13396318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6921771A Expired JPS5437473B2 (enrdf_load_stackoverflow) | 1971-09-09 | 1971-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5437473B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51104488A (en) * | 1975-03-13 | 1976-09-16 | Toyota Motor Co Ltd | Shokubaitantai oyobi shokubai |
| JPS5252193A (en) * | 1975-10-23 | 1977-04-26 | Toyota Motor Corp | Catalyst for purifying exhaust gas from cars |
| JPS62163943U (enrdf_load_stackoverflow) * | 1986-04-08 | 1987-10-17 | ||
| JPH06821Y2 (ja) * | 1987-12-25 | 1994-01-05 | シチズン時計株式会社 | 半導体装置の実装構造 |
| US7332805B2 (en) | 2004-01-06 | 2008-02-19 | International Business Machines Corporation | Electronic package with improved current carrying capability and method of forming the same |
-
1971
- 1971-09-09 JP JP6921771A patent/JPS5437473B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4834674A (enrdf_load_stackoverflow) | 1973-05-21 |