JPS5437074U - - Google Patents

Info

Publication number
JPS5437074U
JPS5437074U JP1977111200U JP11120077U JPS5437074U JP S5437074 U JPS5437074 U JP S5437074U JP 1977111200 U JP1977111200 U JP 1977111200U JP 11120077 U JP11120077 U JP 11120077U JP S5437074 U JPS5437074 U JP S5437074U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977111200U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977111200U priority Critical patent/JPS5437074U/ja
Publication of JPS5437074U publication Critical patent/JPS5437074U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1977111200U 1977-08-19 1977-08-19 Pending JPS5437074U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977111200U JPS5437074U (enExample) 1977-08-19 1977-08-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977111200U JPS5437074U (enExample) 1977-08-19 1977-08-19

Publications (1)

Publication Number Publication Date
JPS5437074U true JPS5437074U (enExample) 1979-03-10

Family

ID=29058806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977111200U Pending JPS5437074U (enExample) 1977-08-19 1977-08-19

Country Status (1)

Country Link
JP (1) JPS5437074U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8292269B2 (en) 2009-04-24 2012-10-23 Anlet Co., Ltd. Microscopic bubble generating apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226878B1 (enExample) * 1972-07-03 1977-07-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226878B1 (enExample) * 1972-07-03 1977-07-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8292269B2 (en) 2009-04-24 2012-10-23 Anlet Co., Ltd. Microscopic bubble generating apparatus

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