JPS543659Y2 - - Google Patents

Info

Publication number
JPS543659Y2
JPS543659Y2 JP1974121123U JP12112374U JPS543659Y2 JP S543659 Y2 JPS543659 Y2 JP S543659Y2 JP 1974121123 U JP1974121123 U JP 1974121123U JP 12112374 U JP12112374 U JP 12112374U JP S543659 Y2 JPS543659 Y2 JP S543659Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1974121123U
Other languages
Japanese (ja)
Other versions
JPS5147664U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974121123U priority Critical patent/JPS543659Y2/ja
Priority to DE2542174A priority patent/DE2542174C3/en
Priority to GB38842/75A priority patent/GB1483849A/en
Publication of JPS5147664U publication Critical patent/JPS5147664U/ja
Priority to US05/757,684 priority patent/US4092614A/en
Application granted granted Critical
Publication of JPS543659Y2 publication Critical patent/JPS543659Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1974121123U 1974-09-21 1974-10-05 Expired JPS543659Y2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1974121123U JPS543659Y2 (en) 1974-10-05 1974-10-05
DE2542174A DE2542174C3 (en) 1974-09-21 1975-09-22 Semiconductor laser device
GB38842/75A GB1483849A (en) 1974-09-21 1975-09-22 Semiconductor laser device equipped with a silicon heat sink
US05/757,684 US4092614A (en) 1974-09-21 1977-01-07 Semiconductor laser device equipped with a silicon heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974121123U JPS543659Y2 (en) 1974-10-05 1974-10-05

Publications (2)

Publication Number Publication Date
JPS5147664U JPS5147664U (en) 1976-04-08
JPS543659Y2 true JPS543659Y2 (en) 1979-02-20

Family

ID=28363629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974121123U Expired JPS543659Y2 (en) 1974-09-21 1974-10-05

Country Status (1)

Country Link
JP (1) JPS543659Y2 (en)

Also Published As

Publication number Publication date
JPS5147664U (en) 1976-04-08

Similar Documents

Publication Publication Date Title
JPS50130239A (en)
JPS50159336A (en)
FR2284901B1 (en)
JPS5134275U (en)
JPS50149192A (en)
AU7463174A (en)
JPS5161763U (en)
JPS50122730A (en)
JPS50130513U (en)
JPS50146715U (en)
CH576295A5 (en)
CH579473A5 (en)
BG20145A1 (en)
BG20657A1 (en)
BG20739A1 (en)
BG21531A1 (en)
BG22309A1 (en)
BG22423A1 (en)
BG22574A1 (en)
BG23349A1 (en)
BG26956A3 (en)
CH571686A5 (en)
CH571689A5 (en)
CH575298A5 (en)
BG19819A1 (en)