JPS5436074B2 - - Google Patents
Info
- Publication number
- JPS5436074B2 JPS5436074B2 JP14548575A JP14548575A JPS5436074B2 JP S5436074 B2 JPS5436074 B2 JP S5436074B2 JP 14548575 A JP14548575 A JP 14548575A JP 14548575 A JP14548575 A JP 14548575A JP S5436074 B2 JPS5436074 B2 JP S5436074B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50145485A JPS5268370A (en) | 1975-12-05 | 1975-12-05 | Semiconductor container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50145485A JPS5268370A (en) | 1975-12-05 | 1975-12-05 | Semiconductor container |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55113838A Division JPS5810858B2 (ja) | 1980-08-18 | 1980-08-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5268370A JPS5268370A (en) | 1977-06-07 |
| JPS5436074B2 true JPS5436074B2 (en, 2012) | 1979-11-07 |
Family
ID=15386338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50145485A Granted JPS5268370A (en) | 1975-12-05 | 1975-12-05 | Semiconductor container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5268370A (en, 2012) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5130295B2 (en, 2012) * | 1971-08-25 | 1976-08-31 | ||
| JPS4939019U (en, 2012) * | 1972-07-10 | 1974-04-06 | ||
| JPS4940271U (en, 2012) * | 1972-07-06 | 1974-04-09 | ||
| JPS5119696Y2 (en, 2012) * | 1972-07-07 | 1976-05-24 | ||
| US3862976A (en) * | 1972-07-31 | 1975-01-28 | Morton Norwich Products Inc | Isocyanophenyl carbamates |
-
1975
- 1975-12-05 JP JP50145485A patent/JPS5268370A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5268370A (en) | 1977-06-07 |