JPS5435182B2 - - Google Patents
Info
- Publication number
- JPS5435182B2 JPS5435182B2 JP8626772A JP8626772A JPS5435182B2 JP S5435182 B2 JPS5435182 B2 JP S5435182B2 JP 8626772 A JP8626772 A JP 8626772A JP 8626772 A JP8626772 A JP 8626772A JP S5435182 B2 JPS5435182 B2 JP S5435182B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8626772A JPS5435182B2 (en) | 1972-08-30 | 1972-08-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8626772A JPS5435182B2 (en) | 1972-08-30 | 1972-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4942544A JPS4942544A (en) | 1974-04-22 |
JPS5435182B2 true JPS5435182B2 (en) | 1979-10-31 |
Family
ID=13882030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8626772A Expired JPS5435182B2 (en) | 1972-08-30 | 1972-08-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5435182B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200085350A (en) | 2017-12-06 | 2020-07-14 | 센주긴조쿠고교 가부시키가이샤 | Cu ball, OSP-treated Cu ball, Cu core ball, solder joint, solder paste, foam solder, and manufacturing method of Cu ball |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51101748A (en) * | 1975-03-05 | 1976-09-08 | Soki Kogyo Kk | KORUGEETOBANTOHEITANBANTONO JIDOYOSETSUHOHO OYOBI SONOSOCHI |
-
1972
- 1972-08-30 JP JP8626772A patent/JPS5435182B2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200085350A (en) | 2017-12-06 | 2020-07-14 | 센주긴조쿠고교 가부시키가이샤 | Cu ball, OSP-treated Cu ball, Cu core ball, solder joint, solder paste, foam solder, and manufacturing method of Cu ball |
KR20230003590A (en) | 2017-12-06 | 2023-01-06 | 센주긴조쿠고교 가부시키가이샤 | Cu BALL, OSP-TREATED Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND FOAM SOLDER, AND METHOD FOR MANUFACTURING Cu BALL |
Also Published As
Publication number | Publication date |
---|---|
JPS4942544A (en) | 1974-04-22 |