JPS5433426Y2 - - Google Patents
Info
- Publication number
- JPS5433426Y2 JPS5433426Y2 JP1973101578U JP10157873U JPS5433426Y2 JP S5433426 Y2 JPS5433426 Y2 JP S5433426Y2 JP 1973101578 U JP1973101578 U JP 1973101578U JP 10157873 U JP10157873 U JP 10157873U JP S5433426 Y2 JPS5433426 Y2 JP S5433426Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10125—Reinforcing structures
- H01L2224/10126—Bump collar
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Static Random-Access Memory (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973101578U JPS5433426Y2 (cs) | 1973-08-31 | 1973-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973101578U JPS5433426Y2 (cs) | 1973-08-31 | 1973-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5048549U JPS5048549U (cs) | 1975-05-13 |
| JPS5433426Y2 true JPS5433426Y2 (cs) | 1979-10-15 |
Family
ID=28308801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973101578U Expired JPS5433426Y2 (cs) | 1973-08-31 | 1973-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5433426Y2 (cs) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542548B2 (cs) * | 1972-02-26 | 1979-02-08 |
-
1973
- 1973-08-31 JP JP1973101578U patent/JPS5433426Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5048549U (cs) | 1975-05-13 |