JPS5433060U - - Google Patents
Info
- Publication number
- JPS5433060U JPS5433060U JP1977106496U JP10649677U JPS5433060U JP S5433060 U JPS5433060 U JP S5433060U JP 1977106496 U JP1977106496 U JP 1977106496U JP 10649677 U JP10649677 U JP 10649677U JP S5433060 U JPS5433060 U JP S5433060U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977106496U JPS5756523Y2 (zh) | 1977-08-08 | 1977-08-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977106496U JPS5756523Y2 (zh) | 1977-08-08 | 1977-08-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5433060U true JPS5433060U (zh) | 1979-03-03 |
JPS5756523Y2 JPS5756523Y2 (zh) | 1982-12-04 |
Family
ID=29049726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977106496U Expired JPS5756523Y2 (zh) | 1977-08-08 | 1977-08-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5756523Y2 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085066U (ja) * | 1983-11-18 | 1985-06-12 | 株式会社日立製作所 | 電池収納装置 |
JPS6338257U (zh) * | 1986-08-28 | 1988-03-11 | ||
JPS6338255U (zh) * | 1986-08-28 | 1988-03-11 | ||
JPS6338256U (zh) * | 1986-08-28 | 1988-03-11 | ||
JPS6339861U (zh) * | 1986-09-01 | 1988-03-15 |
-
1977
- 1977-08-08 JP JP1977106496U patent/JPS5756523Y2/ja not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085066U (ja) * | 1983-11-18 | 1985-06-12 | 株式会社日立製作所 | 電池収納装置 |
JPS6338257U (zh) * | 1986-08-28 | 1988-03-11 | ||
JPS6338255U (zh) * | 1986-08-28 | 1988-03-11 | ||
JPS6338256U (zh) * | 1986-08-28 | 1988-03-11 | ||
JPH0454684Y2 (zh) * | 1986-08-28 | 1992-12-22 | ||
JPH0454686Y2 (zh) * | 1986-08-28 | 1992-12-22 | ||
JPH0518849Y2 (zh) * | 1986-08-28 | 1993-05-19 | ||
JPS6339861U (zh) * | 1986-09-01 | 1988-03-15 | ||
JPH0454689Y2 (zh) * | 1986-09-01 | 1992-12-22 |
Also Published As
Publication number | Publication date |
---|---|
JPS5756523Y2 (zh) | 1982-12-04 |