JPS5433060U - - Google Patents

Info

Publication number
JPS5433060U
JPS5433060U JP1977106496U JP10649677U JPS5433060U JP S5433060 U JPS5433060 U JP S5433060U JP 1977106496 U JP1977106496 U JP 1977106496U JP 10649677 U JP10649677 U JP 10649677U JP S5433060 U JPS5433060 U JP S5433060U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1977106496U
Other languages
Japanese (ja)
Other versions
JPS5756523Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977106496U priority Critical patent/JPS5756523Y2/ja
Publication of JPS5433060U publication Critical patent/JPS5433060U/ja
Application granted granted Critical
Publication of JPS5756523Y2 publication Critical patent/JPS5756523Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
JP1977106496U 1977-08-08 1977-08-08 Expired JPS5756523Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977106496U JPS5756523Y2 (cs) 1977-08-08 1977-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977106496U JPS5756523Y2 (cs) 1977-08-08 1977-08-08

Publications (2)

Publication Number Publication Date
JPS5433060U true JPS5433060U (cs) 1979-03-03
JPS5756523Y2 JPS5756523Y2 (cs) 1982-12-04

Family

ID=29049726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977106496U Expired JPS5756523Y2 (cs) 1977-08-08 1977-08-08

Country Status (1)

Country Link
JP (1) JPS5756523Y2 (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085066U (ja) * 1983-11-18 1985-06-12 株式会社日立製作所 電池収納装置
JPS6338256U (cs) * 1986-08-28 1988-03-11
JPS6338255U (cs) * 1986-08-28 1988-03-11
JPS6338257U (cs) * 1986-08-28 1988-03-11
JPS6339861U (cs) * 1986-09-01 1988-03-15

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085066U (ja) * 1983-11-18 1985-06-12 株式会社日立製作所 電池収納装置
JPS6338256U (cs) * 1986-08-28 1988-03-11
JPS6338255U (cs) * 1986-08-28 1988-03-11
JPS6338257U (cs) * 1986-08-28 1988-03-11
JPH0454684Y2 (cs) * 1986-08-28 1992-12-22
JPH0454686Y2 (cs) * 1986-08-28 1992-12-22
JPH0518849Y2 (cs) * 1986-08-28 1993-05-19
JPS6339861U (cs) * 1986-09-01 1988-03-15
JPH0454689Y2 (cs) * 1986-09-01 1992-12-22

Also Published As

Publication number Publication date
JPS5756523Y2 (cs) 1982-12-04

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