JPS5429865B2 - - Google Patents
Info
- Publication number
- JPS5429865B2 JPS5429865B2 JP6106171A JP6106171A JPS5429865B2 JP S5429865 B2 JPS5429865 B2 JP S5429865B2 JP 6106171 A JP6106171 A JP 6106171A JP 6106171 A JP6106171 A JP 6106171A JP S5429865 B2 JPS5429865 B2 JP S5429865B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6106171A JPS5429865B2 (en) | 1971-08-13 | 1971-08-13 | |
| DE19722239676 DE2239676A1 (en) | 1971-08-13 | 1972-08-11 | Direct electroless gold plating - on tungsten and molybdenum, using alkaline plating soln |
| US05/546,923 US3993808A (en) | 1971-08-13 | 1975-02-04 | Method for electroless plating gold directly on tungsten or molybdenum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6106171A JPS5429865B2 (en) | 1971-08-13 | 1971-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4827683A JPS4827683A (en) | 1973-04-12 |
| JPS5429865B2 true JPS5429865B2 (en) | 1979-09-26 |
Family
ID=13160266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6106171A Expired JPS5429865B2 (en) | 1971-08-13 | 1971-08-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5429865B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS553821B2 (en) * | 1972-06-22 | 1980-01-26 | ||
| JPS5136108A (en) * | 1974-09-21 | 1976-03-26 | Mizuki Seimitsu Kk | |
| JPS51129672A (en) * | 1975-04-11 | 1976-11-11 | Hitachi Chemical Co Ltd | Method of manufacturing ceramic circuit board |
| JPS5282369U (en) * | 1975-12-16 | 1977-06-20 | ||
| JPS5660038A (en) * | 1980-10-20 | 1981-05-23 | Nec Corp | Semiconductor device |
| JPS60124892A (en) * | 1983-12-09 | 1985-07-03 | 日本特殊陶業株式会社 | Method of producing ic package with leads |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3147547A (en) * | 1960-03-10 | 1964-09-08 | Gen Electric | Coating refractory metals |
| US3230098A (en) * | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
| US3281931A (en) * | 1963-10-10 | 1966-11-01 | Bendix Corp | High temperature ceramic-metal seal |
| US3551997A (en) * | 1967-10-06 | 1971-01-05 | Rca Corp | Methods for electroless plating and for brazing |
-
1971
- 1971-08-13 JP JP6106171A patent/JPS5429865B2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3147547A (en) * | 1960-03-10 | 1964-09-08 | Gen Electric | Coating refractory metals |
| US3230098A (en) * | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
| US3281931A (en) * | 1963-10-10 | 1966-11-01 | Bendix Corp | High temperature ceramic-metal seal |
| US3551997A (en) * | 1967-10-06 | 1971-01-05 | Rca Corp | Methods for electroless plating and for brazing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4827683A (en) | 1973-04-12 |