JPS5424827B2 - - Google Patents

Info

Publication number
JPS5424827B2
JPS5424827B2 JP15835675A JP15835675A JPS5424827B2 JP S5424827 B2 JPS5424827 B2 JP S5424827B2 JP 15835675 A JP15835675 A JP 15835675A JP 15835675 A JP15835675 A JP 15835675A JP S5424827 B2 JPS5424827 B2 JP S5424827B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15835675A
Other languages
Japanese (ja)
Other versions
JPS5282075A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15835675A priority Critical patent/JPS5282075A/ja
Publication of JPS5282075A publication Critical patent/JPS5282075A/ja
Publication of JPS5424827B2 publication Critical patent/JPS5424827B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP15835675A 1975-12-27 1975-12-27 Apparatus for wire bonding Granted JPS5282075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15835675A JPS5282075A (en) 1975-12-27 1975-12-27 Apparatus for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15835675A JPS5282075A (en) 1975-12-27 1975-12-27 Apparatus for wire bonding

Publications (2)

Publication Number Publication Date
JPS5282075A JPS5282075A (en) 1977-07-08
JPS5424827B2 true JPS5424827B2 (sv) 1979-08-23

Family

ID=15669863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15835675A Granted JPS5282075A (en) 1975-12-27 1975-12-27 Apparatus for wire bonding

Country Status (1)

Country Link
JP (1) JPS5282075A (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6217355Y2 (sv) * 1980-04-01 1987-05-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6217355Y2 (sv) * 1980-04-01 1987-05-02

Also Published As

Publication number Publication date
JPS5282075A (en) 1977-07-08

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