JPS5424823B2 - - Google Patents
Info
- Publication number
- JPS5424823B2 JPS5424823B2 JP4502275A JP4502275A JPS5424823B2 JP S5424823 B2 JPS5424823 B2 JP S5424823B2 JP 4502275 A JP4502275 A JP 4502275A JP 4502275 A JP4502275 A JP 4502275A JP S5424823 B2 JPS5424823 B2 JP S5424823B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50045022A JPS51120176A (en) | 1975-04-14 | 1975-04-14 | Method of evaluating bonding characteristic of metal surfaces of micro electric parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50045022A JPS51120176A (en) | 1975-04-14 | 1975-04-14 | Method of evaluating bonding characteristic of metal surfaces of micro electric parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51120176A JPS51120176A (en) | 1976-10-21 |
| JPS5424823B2 true JPS5424823B2 (sk) | 1979-08-23 |
Family
ID=12707700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50045022A Granted JPS51120176A (en) | 1975-04-14 | 1975-04-14 | Method of evaluating bonding characteristic of metal surfaces of micro electric parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51120176A (sk) |
-
1975
- 1975-04-14 JP JP50045022A patent/JPS51120176A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51120176A (en) | 1976-10-21 |