JPS5424822B2 - - Google Patents
Info
- Publication number
- JPS5424822B2 JPS5424822B2 JP3415775A JP3415775A JPS5424822B2 JP S5424822 B2 JPS5424822 B2 JP S5424822B2 JP 3415775 A JP3415775 A JP 3415775A JP 3415775 A JP3415775 A JP 3415775A JP S5424822 B2 JPS5424822 B2 JP S5424822B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415775A JPS51109775A (en) | 1975-03-20 | 1975-03-20 | Handotaisochino seizohoho |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415775A JPS51109775A (en) | 1975-03-20 | 1975-03-20 | Handotaisochino seizohoho |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51109775A JPS51109775A (en) | 1976-09-28 |
| JPS5424822B2 true JPS5424822B2 (da) | 1979-08-23 |
Family
ID=12406358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3415775A Granted JPS51109775A (en) | 1975-03-20 | 1975-03-20 | Handotaisochino seizohoho |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51109775A (da) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008926A1 (en) * | 1988-03-16 | 1989-09-21 | Plessey Overseas Limited | Vernier structure for flip chip bonded devices |
-
1975
- 1975-03-20 JP JP3415775A patent/JPS51109775A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51109775A (en) | 1976-09-28 |