JPS5423794B2 - - Google Patents

Info

Publication number
JPS5423794B2
JPS5423794B2 JP1052575A JP1052575A JPS5423794B2 JP S5423794 B2 JPS5423794 B2 JP S5423794B2 JP 1052575 A JP1052575 A JP 1052575A JP 1052575 A JP1052575 A JP 1052575A JP S5423794 B2 JPS5423794 B2 JP S5423794B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1052575A
Other languages
Japanese (ja)
Other versions
JPS5185669A (index.php
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1052575A priority Critical patent/JPS5423794B2/ja
Publication of JPS5185669A publication Critical patent/JPS5185669A/ja
Publication of JPS5423794B2 publication Critical patent/JPS5423794B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/522—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/555—

Landscapes

  • Wire Bonding (AREA)
JP1052575A 1975-01-27 1975-01-27 Expired JPS5423794B2 (index.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1052575A JPS5423794B2 (index.php) 1975-01-27 1975-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1052575A JPS5423794B2 (index.php) 1975-01-27 1975-01-27

Publications (2)

Publication Number Publication Date
JPS5185669A JPS5185669A (index.php) 1976-07-27
JPS5423794B2 true JPS5423794B2 (index.php) 1979-08-16

Family

ID=11752652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1052575A Expired JPS5423794B2 (index.php) 1975-01-27 1975-01-27

Country Status (1)

Country Link
JP (1) JPS5423794B2 (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105810652A (zh) * 2015-01-19 2016-07-27 Mk电子株式会社 接合线

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614650U (index.php) * 1979-07-14 1981-02-07
JPS56169341A (en) * 1980-05-31 1981-12-26 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element
US6711925B2 (en) * 2001-12-17 2004-03-30 Asep Tec Co., Ltd. Process for manufacturing a conductive wire suitable for use in semiconductor packages
EP2822029B1 (en) * 2012-02-27 2024-12-18 Nippon Micrometal Corporation Bonding wire
MY175700A (en) 2014-01-31 2020-07-06 Tatsuta Electric Wire & Cable Co Ltd Wire bonding and method of manufacturing wire bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105810652A (zh) * 2015-01-19 2016-07-27 Mk电子株式会社 接合线

Also Published As

Publication number Publication date
JPS5185669A (index.php) 1976-07-27

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