JPS542370U - - Google Patents
Info
- Publication number
- JPS542370U JPS542370U JP7369977U JP7369977U JPS542370U JP S542370 U JPS542370 U JP S542370U JP 7369977 U JP7369977 U JP 7369977U JP 7369977 U JP7369977 U JP 7369977U JP S542370 U JPS542370 U JP S542370U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7369977U JPS542370U (sk) | 1977-06-08 | 1977-06-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7369977U JPS542370U (sk) | 1977-06-08 | 1977-06-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS542370U true JPS542370U (sk) | 1979-01-09 |
Family
ID=28986546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7369977U Pending JPS542370U (sk) | 1977-06-08 | 1977-06-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS542370U (sk) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5387865U (sk) * | 1976-12-21 | 1978-07-19 | ||
JPS6052653U (ja) * | 1983-09-19 | 1985-04-13 | 矢崎総業株式会社 | 有極性電子部品の配線基板 |
JPS6088573U (ja) * | 1983-11-22 | 1985-06-18 | 矢崎総業株式会社 | 有極性電子部品の配線基板 |
JPS61100136U (sk) * | 1984-12-07 | 1986-06-26 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS502465A (sk) * | 1973-05-07 | 1975-01-11 |
-
1977
- 1977-06-08 JP JP7369977U patent/JPS542370U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS502465A (sk) * | 1973-05-07 | 1975-01-11 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5387865U (sk) * | 1976-12-21 | 1978-07-19 | ||
JPS6052653U (ja) * | 1983-09-19 | 1985-04-13 | 矢崎総業株式会社 | 有極性電子部品の配線基板 |
JPS6088573U (ja) * | 1983-11-22 | 1985-06-18 | 矢崎総業株式会社 | 有極性電子部品の配線基板 |
JPS61100136U (sk) * | 1984-12-07 | 1986-06-26 |