JPS5423562U - - Google Patents
Info
- Publication number
- JPS5423562U JPS5423562U JP1977096669U JP9666977U JPS5423562U JP S5423562 U JPS5423562 U JP S5423562U JP 1977096669 U JP1977096669 U JP 1977096669U JP 9666977 U JP9666977 U JP 9666977U JP S5423562 U JPS5423562 U JP S5423562U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977096669U JPS5423562U (enExample) | 1977-07-19 | 1977-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977096669U JPS5423562U (enExample) | 1977-07-19 | 1977-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5423562U true JPS5423562U (enExample) | 1979-02-16 |
Family
ID=29030767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977096669U Pending JPS5423562U (enExample) | 1977-07-19 | 1977-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5423562U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52116371A (en) * | 1976-03-22 | 1977-09-29 | Matsushita Electric Industrial Co Ltd | Kitchen furniture with drip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4911587A (enExample) * | 1972-06-01 | 1974-02-01 |
-
1977
- 1977-07-19 JP JP1977096669U patent/JPS5423562U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4911587A (enExample) * | 1972-06-01 | 1974-02-01 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52116371A (en) * | 1976-03-22 | 1977-09-29 | Matsushita Electric Industrial Co Ltd | Kitchen furniture with drip |