JPS5420119B2 - - Google Patents
Info
- Publication number
- JPS5420119B2 JPS5420119B2 JP7675972A JP7675972A JPS5420119B2 JP S5420119 B2 JPS5420119 B2 JP S5420119B2 JP 7675972 A JP7675972 A JP 7675972A JP 7675972 A JP7675972 A JP 7675972A JP S5420119 B2 JPS5420119 B2 JP S5420119B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7675972A JPS5420119B2 (enrdf_load_stackoverflow) | 1972-07-26 | 1972-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7675972A JPS5420119B2 (enrdf_load_stackoverflow) | 1972-07-26 | 1972-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4933560A JPS4933560A (enrdf_load_stackoverflow) | 1974-03-28 |
| JPS5420119B2 true JPS5420119B2 (enrdf_load_stackoverflow) | 1979-07-20 |
Family
ID=13614502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7675972A Expired JPS5420119B2 (enrdf_load_stackoverflow) | 1972-07-26 | 1972-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5420119B2 (enrdf_load_stackoverflow) |
-
1972
- 1972-07-26 JP JP7675972A patent/JPS5420119B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4933560A (enrdf_load_stackoverflow) | 1974-03-28 |