JPS5419676U - - Google Patents

Info

Publication number
JPS5419676U
JPS5419676U JP1977091158U JP9115877U JPS5419676U JP S5419676 U JPS5419676 U JP S5419676U JP 1977091158 U JP1977091158 U JP 1977091158U JP 9115877 U JP9115877 U JP 9115877U JP S5419676 U JPS5419676 U JP S5419676U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1977091158U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977091158U priority Critical patent/JPS5419676U/ja
Publication of JPS5419676U publication Critical patent/JPS5419676U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1977091158U 1977-07-08 1977-07-08 Pending JPS5419676U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977091158U JPS5419676U (enExample) 1977-07-08 1977-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977091158U JPS5419676U (enExample) 1977-07-08 1977-07-08

Publications (1)

Publication Number Publication Date
JPS5419676U true JPS5419676U (enExample) 1979-02-08

Family

ID=29020172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977091158U Pending JPS5419676U (enExample) 1977-07-08 1977-07-08

Country Status (1)

Country Link
JP (1) JPS5419676U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134376A (en) * 1981-02-13 1982-08-19 Yamaha Motor Co Ltd Hull structure of rowboat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57134376A (en) * 1981-02-13 1982-08-19 Yamaha Motor Co Ltd Hull structure of rowboat

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