JPS5419172A - Method of making flexible throughhhole print wire substrate - Google Patents

Method of making flexible throughhhole print wire substrate

Info

Publication number
JPS5419172A
JPS5419172A JP8450677A JP8450677A JPS5419172A JP S5419172 A JPS5419172 A JP S5419172A JP 8450677 A JP8450677 A JP 8450677A JP 8450677 A JP8450677 A JP 8450677A JP S5419172 A JPS5419172 A JP S5419172A
Authority
JP
Japan
Prior art keywords
throughhhole
wire substrate
print wire
making flexible
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8450677A
Other languages
Japanese (ja)
Inventor
Masaharu Iizaka
Katsuzou Yamamuro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHINDO DENSHI KOUGIYOU KK
Original Assignee
SHINDO DENSHI KOUGIYOU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHINDO DENSHI KOUGIYOU KK filed Critical SHINDO DENSHI KOUGIYOU KK
Priority to JP8450677A priority Critical patent/JPS5419172A/en
Publication of JPS5419172A publication Critical patent/JPS5419172A/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP8450677A 1977-07-14 1977-07-14 Method of making flexible throughhhole print wire substrate Pending JPS5419172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8450677A JPS5419172A (en) 1977-07-14 1977-07-14 Method of making flexible throughhhole print wire substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8450677A JPS5419172A (en) 1977-07-14 1977-07-14 Method of making flexible throughhhole print wire substrate

Publications (1)

Publication Number Publication Date
JPS5419172A true JPS5419172A (en) 1979-02-13

Family

ID=13832521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8450677A Pending JPS5419172A (en) 1977-07-14 1977-07-14 Method of making flexible throughhhole print wire substrate

Country Status (1)

Country Link
JP (1) JPS5419172A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160194A (en) * 1984-01-31 1985-08-21 住友金属鉱山株式会社 Through hole conducting method
JPH01138788A (en) * 1987-11-26 1989-05-31 Asahi Chem Ind Co Ltd Through-hole circuit substrate and manufacture thereof
JPH02256296A (en) * 1989-03-29 1990-10-17 Japan Radio Co Ltd Method of filling through-hole of printed circuit board with solder
JPH04130466U (en) * 1991-05-16 1992-11-30 シヤープ株式会社 flexible printed wiring board
JPH0686398A (en) * 1991-12-23 1994-03-25 American Teleph & Telegr Co <Att> Transducer device
JP2011091112A (en) * 2009-10-20 2011-05-06 Freesia Makurosu Kk Method for manufacturing electronic component mounting substrate and electronic component mounting substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4421624Y1 (en) * 1965-10-06 1969-09-12
JPS507067A (en) * 1973-05-23 1975-01-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4421624Y1 (en) * 1965-10-06 1969-09-12
JPS507067A (en) * 1973-05-23 1975-01-24

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160194A (en) * 1984-01-31 1985-08-21 住友金属鉱山株式会社 Through hole conducting method
JPH01138788A (en) * 1987-11-26 1989-05-31 Asahi Chem Ind Co Ltd Through-hole circuit substrate and manufacture thereof
JPH02256296A (en) * 1989-03-29 1990-10-17 Japan Radio Co Ltd Method of filling through-hole of printed circuit board with solder
JPH04130466U (en) * 1991-05-16 1992-11-30 シヤープ株式会社 flexible printed wiring board
JPH0686398A (en) * 1991-12-23 1994-03-25 American Teleph & Telegr Co <Att> Transducer device
JP2011091112A (en) * 2009-10-20 2011-05-06 Freesia Makurosu Kk Method for manufacturing electronic component mounting substrate and electronic component mounting substrate

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