JPS5419172A - Method of making flexible throughhhole print wire substrate - Google Patents
Method of making flexible throughhhole print wire substrateInfo
- Publication number
- JPS5419172A JPS5419172A JP8450677A JP8450677A JPS5419172A JP S5419172 A JPS5419172 A JP S5419172A JP 8450677 A JP8450677 A JP 8450677A JP 8450677 A JP8450677 A JP 8450677A JP S5419172 A JPS5419172 A JP S5419172A
- Authority
- JP
- Japan
- Prior art keywords
- throughhhole
- wire substrate
- print wire
- making flexible
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8450677A JPS5419172A (en) | 1977-07-14 | 1977-07-14 | Method of making flexible throughhhole print wire substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8450677A JPS5419172A (en) | 1977-07-14 | 1977-07-14 | Method of making flexible throughhhole print wire substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5419172A true JPS5419172A (en) | 1979-02-13 |
Family
ID=13832521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8450677A Pending JPS5419172A (en) | 1977-07-14 | 1977-07-14 | Method of making flexible throughhhole print wire substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5419172A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160194A (en) * | 1984-01-31 | 1985-08-21 | 住友金属鉱山株式会社 | Through hole conducting method |
JPH01138788A (en) * | 1987-11-26 | 1989-05-31 | Asahi Chem Ind Co Ltd | Through-hole circuit substrate and manufacture thereof |
JPH02256296A (en) * | 1989-03-29 | 1990-10-17 | Japan Radio Co Ltd | Method of filling through-hole of printed circuit board with solder |
JPH04130466U (en) * | 1991-05-16 | 1992-11-30 | シヤープ株式会社 | flexible printed wiring board |
JPH0686398A (en) * | 1991-12-23 | 1994-03-25 | American Teleph & Telegr Co <Att> | Transducer device |
JP2011091112A (en) * | 2009-10-20 | 2011-05-06 | Freesia Makurosu Kk | Method for manufacturing electronic component mounting substrate and electronic component mounting substrate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4421624Y1 (en) * | 1965-10-06 | 1969-09-12 | ||
JPS507067A (en) * | 1973-05-23 | 1975-01-24 |
-
1977
- 1977-07-14 JP JP8450677A patent/JPS5419172A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4421624Y1 (en) * | 1965-10-06 | 1969-09-12 | ||
JPS507067A (en) * | 1973-05-23 | 1975-01-24 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160194A (en) * | 1984-01-31 | 1985-08-21 | 住友金属鉱山株式会社 | Through hole conducting method |
JPH01138788A (en) * | 1987-11-26 | 1989-05-31 | Asahi Chem Ind Co Ltd | Through-hole circuit substrate and manufacture thereof |
JPH02256296A (en) * | 1989-03-29 | 1990-10-17 | Japan Radio Co Ltd | Method of filling through-hole of printed circuit board with solder |
JPH04130466U (en) * | 1991-05-16 | 1992-11-30 | シヤープ株式会社 | flexible printed wiring board |
JPH0686398A (en) * | 1991-12-23 | 1994-03-25 | American Teleph & Telegr Co <Att> | Transducer device |
JP2011091112A (en) * | 2009-10-20 | 2011-05-06 | Freesia Makurosu Kk | Method for manufacturing electronic component mounting substrate and electronic component mounting substrate |
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