JPS5419164Y2 - - Google Patents

Info

Publication number
JPS5419164Y2
JPS5419164Y2 JP15333574U JP15333574U JPS5419164Y2 JP S5419164 Y2 JPS5419164 Y2 JP S5419164Y2 JP 15333574 U JP15333574 U JP 15333574U JP 15333574 U JP15333574 U JP 15333574U JP S5419164 Y2 JPS5419164 Y2 JP S5419164Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15333574U
Other versions
JPS5178748U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15333574U priority Critical patent/JPS5419164Y2/ja
Publication of JPS5178748U publication Critical patent/JPS5178748U/ja
Application granted granted Critical
Publication of JPS5419164Y2 publication Critical patent/JPS5419164Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
JP15333574U 1974-12-17 1974-12-17 Expired JPS5419164Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15333574U JPS5419164Y2 (ja) 1974-12-17 1974-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15333574U JPS5419164Y2 (ja) 1974-12-17 1974-12-17

Publications (2)

Publication Number Publication Date
JPS5178748U JPS5178748U (ja) 1976-06-22
JPS5419164Y2 true JPS5419164Y2 (ja) 1979-07-16

Family

ID=28444786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15333574U Expired JPS5419164Y2 (ja) 1974-12-17 1974-12-17

Country Status (1)

Country Link
JP (1) JPS5419164Y2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584836B2 (ja) * 1978-08-04 1983-01-27 富士通株式会社 光半導体素子パッケ−ジ

Also Published As

Publication number Publication date
JPS5178748U (ja) 1976-06-22

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