JPS54167667U - - Google Patents
Info
- Publication number
- JPS54167667U JPS54167667U JP6563078U JP6563078U JPS54167667U JP S54167667 U JPS54167667 U JP S54167667U JP 6563078 U JP6563078 U JP 6563078U JP 6563078 U JP6563078 U JP 6563078U JP S54167667 U JPS54167667 U JP S54167667U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6563078U JPS54167667U (ja) | 1978-05-15 | 1978-05-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6563078U JPS54167667U (ja) | 1978-05-15 | 1978-05-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54167667U true JPS54167667U (ja) | 1979-11-26 |
Family
ID=28970876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6563078U Pending JPS54167667U (ja) | 1978-05-15 | 1978-05-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54167667U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015053442A (ja) * | 2013-09-09 | 2015-03-19 | 三菱電機株式会社 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5013877A (ja) * | 1973-06-12 | 1975-02-13 | ||
JPS5133360B1 (ja) * | 1971-01-21 | 1976-09-18 |
-
1978
- 1978-05-15 JP JP6563078U patent/JPS54167667U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5133360B1 (ja) * | 1971-01-21 | 1976-09-18 | ||
JPS5013877A (ja) * | 1973-06-12 | 1975-02-13 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015053442A (ja) * | 2013-09-09 | 2015-03-19 | 三菱電機株式会社 | 半導体装置 |