JPS54160565U - - Google Patents
Info
- Publication number
- JPS54160565U JPS54160565U JP1978058818U JP5881878U JPS54160565U JP S54160565 U JPS54160565 U JP S54160565U JP 1978058818 U JP1978058818 U JP 1978058818U JP 5881878 U JP5881878 U JP 5881878U JP S54160565 U JPS54160565 U JP S54160565U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978058818U JPS54160565U (enExample) | 1978-04-28 | 1978-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978058818U JPS54160565U (enExample) | 1978-04-28 | 1978-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54160565U true JPS54160565U (enExample) | 1979-11-09 |
Family
ID=28957973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978058818U Pending JPS54160565U (enExample) | 1978-04-28 | 1978-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54160565U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025469B2 (enExample) * | 1972-08-18 | 1975-08-23 | ||
| JPS5237455B2 (enExample) * | 1972-11-01 | 1977-09-22 |
-
1978
- 1978-04-28 JP JP1978058818U patent/JPS54160565U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025469B2 (enExample) * | 1972-08-18 | 1975-08-23 | ||
| JPS5237455B2 (enExample) * | 1972-11-01 | 1977-09-22 |