JPS54159867A - Electronic parts - Google Patents

Electronic parts

Info

Publication number
JPS54159867A
JPS54159867A JP6947378A JP6947378A JPS54159867A JP S54159867 A JPS54159867 A JP S54159867A JP 6947378 A JP6947378 A JP 6947378A JP 6947378 A JP6947378 A JP 6947378A JP S54159867 A JPS54159867 A JP S54159867A
Authority
JP
Japan
Prior art keywords
metallic mold
gloss
discharge process
resin
transferred
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6947378A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Toshio Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6947378A priority Critical patent/JPS54159867A/en
Publication of JPS54159867A publication Critical patent/JPS54159867A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a sufficient migration-proof effect by causing the resin surface between lead wires of electronic parts to include the face where the surface state of a discharge process metallic mold is transcribed.
CONSTITUTION: The resin surface where the surface state of a discharge process metallic mold is transferred is superior to the resin surface, where the surface state of a gloss metallic mold is transferred, in migration-proof characteristic, because the discharge metallic mold surface is smooth macroscopically and has many uneven faces of several microns to several hundred microns microscopically and the surface distance between leads is several times as long as the simple gloss surface practically and the current quantity leaking through the surface becomes different. Further, another reason is the fact that the water adhesion to the surface is difficult because of the transfer of the discharge process metallic mold surface similarly to the gloss metallic mold transcription surface.
COPYRIGHT: (C)1979,JPO&Japio
JP6947378A 1978-06-08 1978-06-08 Electronic parts Pending JPS54159867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6947378A JPS54159867A (en) 1978-06-08 1978-06-08 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6947378A JPS54159867A (en) 1978-06-08 1978-06-08 Electronic parts

Publications (1)

Publication Number Publication Date
JPS54159867A true JPS54159867A (en) 1979-12-18

Family

ID=13403673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6947378A Pending JPS54159867A (en) 1978-06-08 1978-06-08 Electronic parts

Country Status (1)

Country Link
JP (1) JPS54159867A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021077784A (en) * 2019-11-11 2021-05-20 株式会社デンソー Mold package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021077784A (en) * 2019-11-11 2021-05-20 株式会社デンソー Mold package

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