JPS54159867A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPS54159867A JPS54159867A JP6947378A JP6947378A JPS54159867A JP S54159867 A JPS54159867 A JP S54159867A JP 6947378 A JP6947378 A JP 6947378A JP 6947378 A JP6947378 A JP 6947378A JP S54159867 A JPS54159867 A JP S54159867A
- Authority
- JP
- Japan
- Prior art keywords
- metallic mold
- gloss
- discharge process
- resin
- transferred
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a sufficient migration-proof effect by causing the resin surface between lead wires of electronic parts to include the face where the surface state of a discharge process metallic mold is transcribed.
CONSTITUTION: The resin surface where the surface state of a discharge process metallic mold is transferred is superior to the resin surface, where the surface state of a gloss metallic mold is transferred, in migration-proof characteristic, because the discharge metallic mold surface is smooth macroscopically and has many uneven faces of several microns to several hundred microns microscopically and the surface distance between leads is several times as long as the simple gloss surface practically and the current quantity leaking through the surface becomes different. Further, another reason is the fact that the water adhesion to the surface is difficult because of the transfer of the discharge process metallic mold surface similarly to the gloss metallic mold transcription surface.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6947378A JPS54159867A (en) | 1978-06-08 | 1978-06-08 | Electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6947378A JPS54159867A (en) | 1978-06-08 | 1978-06-08 | Electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54159867A true JPS54159867A (en) | 1979-12-18 |
Family
ID=13403673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6947378A Pending JPS54159867A (en) | 1978-06-08 | 1978-06-08 | Electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54159867A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021077784A (en) * | 2019-11-11 | 2021-05-20 | 株式会社デンソー | Mold package |
-
1978
- 1978-06-08 JP JP6947378A patent/JPS54159867A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021077784A (en) * | 2019-11-11 | 2021-05-20 | 株式会社デンソー | Mold package |
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