JPS54154274A - Method of detecting bonding surface height - Google Patents

Method of detecting bonding surface height

Info

Publication number
JPS54154274A
JPS54154274A JP6226778A JP6226778A JPS54154274A JP S54154274 A JPS54154274 A JP S54154274A JP 6226778 A JP6226778 A JP 6226778A JP 6226778 A JP6226778 A JP 6226778A JP S54154274 A JPS54154274 A JP S54154274A
Authority
JP
Japan
Prior art keywords
bonding surface
surface height
detecting bonding
detecting
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6226778A
Other languages
Japanese (ja)
Other versions
JPS5758052B2 (en
Inventor
Nobuhito Yamazaki
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP6226778A priority Critical patent/JPS54154274A/en
Publication of JPS54154274A publication Critical patent/JPS54154274A/en
Publication of JPS5758052B2 publication Critical patent/JPS5758052B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP6226778A 1978-05-26 1978-05-26 Method of detecting bonding surface height Granted JPS54154274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6226778A JPS54154274A (en) 1978-05-26 1978-05-26 Method of detecting bonding surface height

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6226778A JPS54154274A (en) 1978-05-26 1978-05-26 Method of detecting bonding surface height

Publications (2)

Publication Number Publication Date
JPS54154274A true JPS54154274A (en) 1979-12-05
JPS5758052B2 JPS5758052B2 (en) 1982-12-08

Family

ID=13195194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6226778A Granted JPS54154274A (en) 1978-05-26 1978-05-26 Method of detecting bonding surface height

Country Status (1)

Country Link
JP (1) JPS54154274A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854645A (en) * 1981-09-28 1983-03-31 Toshiba Corp Wire bonding device
JPH01144642A (en) * 1988-07-08 1989-06-06 Nec Corp Wire bonding

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854645A (en) * 1981-09-28 1983-03-31 Toshiba Corp Wire bonding device
JPH01144642A (en) * 1988-07-08 1989-06-06 Nec Corp Wire bonding
JPH05854B2 (en) * 1988-07-08 1993-01-06 Nippon Electric Co

Also Published As

Publication number Publication date
JPS5758052B2 (en) 1982-12-08

Similar Documents

Publication Publication Date Title
GB2019315B (en) Method of making surface covring
JPS5797688A (en) Method of reacting surface
JPS5528389A (en) Surface etching method
JPS5546189A (en) Method of determining ligand
JPS57119422A (en) Method of bonding contact
JPS5528388A (en) Surface etching method
JPS5589752A (en) Method of assay
GB2090566B (en) Method of bonding
DE2967370D1 (en) Method of bonding two members
DE3378139D1 (en) Method of measuring the height of clouds
JPS54154274A (en) Method of detecting bonding surface height
JPS5540990A (en) Method of determining yield point
JPS559974A (en) Timberinggfree method of floor
JPS54159449A (en) Material bonding method
JPS54130882A (en) Method of inspecting semiconductor surface
JPS57108362A (en) Direct application of foundation surface
JPS56134488A (en) Method of solderlessly bonding
JPS54141856A (en) Method of bonding plastics
JPS54108885A (en) Method of bonding
JPS5495957A (en) Method of bonding metallic materials
JPS54128785A (en) Method of detecting flaw on surface
JPS5496512A (en) Refractory bonding method
JPS55148861A (en) Method of bonding tile
JPS5552463A (en) Method of previously bonding tile
JPS54143385A (en) Method of making package