JPS5414659U - - Google Patents

Info

Publication number
JPS5414659U
JPS5414659U JP1977087997U JP8799777U JPS5414659U JP S5414659 U JPS5414659 U JP S5414659U JP 1977087997 U JP1977087997 U JP 1977087997U JP 8799777 U JP8799777 U JP 8799777U JP S5414659 U JPS5414659 U JP S5414659U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1977087997U
Other languages
Japanese (ja)
Other versions
JPS6116702Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977087997U priority Critical patent/JPS6116702Y2/ja
Publication of JPS5414659U publication Critical patent/JPS5414659U/ja
Application granted granted Critical
Publication of JPS6116702Y2 publication Critical patent/JPS6116702Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1977087997U 1977-07-01 1977-07-01 Expired JPS6116702Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977087997U JPS6116702Y2 (https=) 1977-07-01 1977-07-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977087997U JPS6116702Y2 (https=) 1977-07-01 1977-07-01

Publications (2)

Publication Number Publication Date
JPS5414659U true JPS5414659U (https=) 1979-01-30
JPS6116702Y2 JPS6116702Y2 (https=) 1986-05-22

Family

ID=29014052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977087997U Expired JPS6116702Y2 (https=) 1977-07-01 1977-07-01

Country Status (1)

Country Link
JP (1) JPS6116702Y2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122457U (ja) * 1982-02-12 1983-08-20 新電元工業株式会社 半導体装置
JPS58162642U (ja) * 1982-04-22 1983-10-29 新電元工業株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132177A (en) * 1974-09-11 1976-03-18 Matsushita Electric Industrial Co Ltd Riidoresumoorudotoranjisuta

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132177A (en) * 1974-09-11 1976-03-18 Matsushita Electric Industrial Co Ltd Riidoresumoorudotoranjisuta

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122457U (ja) * 1982-02-12 1983-08-20 新電元工業株式会社 半導体装置
JPS58162642U (ja) * 1982-04-22 1983-10-29 新電元工業株式会社 半導体装置

Also Published As

Publication number Publication date
JPS6116702Y2 (https=) 1986-05-22

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