JPS54144154U - - Google Patents
Info
- Publication number
- JPS54144154U JPS54144154U JP4212678U JP4212678U JPS54144154U JP S54144154 U JPS54144154 U JP S54144154U JP 4212678 U JP4212678 U JP 4212678U JP 4212678 U JP4212678 U JP 4212678U JP S54144154 U JPS54144154 U JP S54144154U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4212678U JPS54144154U (enrdf_load_stackoverflow) | 1978-03-30 | 1978-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4212678U JPS54144154U (enrdf_load_stackoverflow) | 1978-03-30 | 1978-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54144154U true JPS54144154U (enrdf_load_stackoverflow) | 1979-10-06 |
Family
ID=28914029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4212678U Pending JPS54144154U (enrdf_load_stackoverflow) | 1978-03-30 | 1978-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54144154U (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4861959A (enrdf_load_stackoverflow) * | 1971-12-06 | 1973-08-30 |
-
1978
- 1978-03-30 JP JP4212678U patent/JPS54144154U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4861959A (enrdf_load_stackoverflow) * | 1971-12-06 | 1973-08-30 |